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Date:   Wed, 4 May 2022 15:10:44 -0500
From:   Rob Herring <robh@kernel.org>
To:     Robert Marko <robimarko@gmail.com>
Cc:     amitk@kernel.org, thara.gopinath@linaro.org, agross@kernel.org,
        bjorn.andersson@linaro.org, rafael@kernel.org,
        daniel.lezcano@linaro.org, rui.zhang@intel.com,
        krzysztof.kozlowski+dt@linaro.org, linux-pm@vger.kernel.org,
        linux-arm-msm@vger.kernel.org, devicetree@vger.kernel.org,
        linux-kernel@vger.kernel.org,
        Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Subject: Re: [PATCH v4 1/5] dt-bindings: thermal: tsens: Add ipq8074
 compatible
Message-ID: <YnLdxF+P7hWwjgZS@robh.at.kernel.org>
References: <20220503200813.4020698-1-robimarko@gmail.com>
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On Tue, May 03, 2022 at 10:08:09PM +0200, Robert Marko wrote:
> Qualcomm IPQ8074 has tsens v2.3.0 block, though unlike existing v2 IP it
> only uses one IRQ, so tsens v2 compatible cannot be used as the fallback.
> 
> We also have to make sure that correct interrupts are set according to
> compatibles, so populate interrupt information per compatibles.
> 
> Signed-off-by: Robert Marko <robimarko@gmail.com>
> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
> ---
> Changes in v4:
> * Add the forgotten Reviewed-by tag from Krzysztof
> 
> Changes in v3:
> * Remove implied min/maxItem properties as pointed by Rob
> 
> Changes in v2:
> * No need for a list in compatible check
> * Specify minItems and maxItems for interrupt and interrupt-names
> ---
>  .../bindings/thermal/qcom-tsens.yaml          | 76 ++++++++++++++++---
>  1 file changed, 65 insertions(+), 11 deletions(-)

Reviewed-by: Rob Herring <robh@kernel.org>