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Message-ID: <49f1e84f-3769-ae8f-b8de-4a5315110f5d@linaro.org>
Date:   Mon, 9 May 2022 12:07:01 +0200
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Subject: Re: [PATCH v2] dt-bindings: thermal: tsens: Add sc8280xp compatible
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To:     Bjorn Andersson <bjorn.andersson@linaro.org>,
        "Rafael J. Wysocki" <rafael@kernel.org>,
        Zhang Rui <rui.zhang@intel.com>
Cc:     Rob Herring <robh+dt@kernel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>,
        linux-pm@vger.kernel.org, linux-arm-msm@vger.kernel.org,
        devicetree@vger.kernel.org, linux-kernel@vger.kernel.org,
        Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
References: <20220503153436.960184-1-bjorn.andersson@linaro.org>
From:   Daniel Lezcano <daniel.lezcano@linaro.org>
In-Reply-To: <20220503153436.960184-1-bjorn.andersson@linaro.org>
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On 03/05/2022 17:34, Bjorn Andersson wrote:
> The Qualcomm SC8280XP platform has three instances of the tsens block,
> add a compatible for these instances.
> 
> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
> Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
> ---

Applied, thanks


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