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Date:   Thu, 28 Jul 2022 17:12:16 +0200
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Subject: Re: [PATCH v3 00/32] New thermal OF code
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To:     "Rafael J. Wysocki" <rafael@kernel.org>
Cc:     Daniel Lezcano <daniel.lezcano@linexp.org>,
        "Zhang, Rui" <rui.zhang@intel.com>,
        Linux PM <linux-pm@vger.kernel.org>,
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From:   Daniel Lezcano <daniel.lezcano@linaro.org>
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Hi Rafael,

On 28/07/2022 16:37, Rafael J. Wysocki wrote:
> Hi Daniel,
> 
> On Wed, Jul 27, 2022 at 11:46 PM Daniel Lezcano
> <daniel.lezcano@linaro.org> wrote:
>>
>>
>> Hi Rafael,
>>
>> we are close to release v5.19.
>>
>> I want to send a PR this week but it would be nice if this series could
>> be part of it, so the trip point rework we discussed earlier (it is a
>> long series) could be merged more easily for v5.21-rc1 as it will depend
>> on these changes.
>>
>> This series was tested on different platforms, rk3399, broadcom and
>> rcar. The external drivers as ata, touchscreen, regulator, hwmon were
>> acked/reviewed and some other thermal drivers reviewed also. Some others
>> remain without feedback because the maintainer is unresponsive or the
>> driver is orphaned, falling under the thermal framework maintenance
>> umbrella. All the drivers changes are the same.
>>
>> I do believe it does a nice cleanup and consolidation of the OF thermal
>> code and realign it with the core thermal framework.
>>
>> Is it ok to merge the series?
> 
> I would prefer to put it into linux-next for a few days.
> 
> Why don't you send 2 pull requests, one with all of the other material
> you have for 5.20 and another one with this series (it may be on top
> of the first one)?
> 
> I will be able to defer pushing the second one till the second half of
> the merge window.

Yes, I agree, if it is fine to do two pull requests, it seems very 
reasonable to let this series to mature in linux-next.

I will setup the 'next' branch with the first pull request material.

Thanks

   -- Daniel


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