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Subject: Re: SMP/cc Cluster description [was Linux/Pro]
To: landley@trommello.org (Rob Landley)
Date: Thu, 6 Dec 2001 00:34:23 +0000 (GMT)
Cc: lm@bitmover.com (Larry McVoy), Martin.Bligh@us.ibm.com (Martin J. Bligh),
        riel@conectiva.com.br (Rik van Riel),
        alan@lxorguk.ukuu.org.uk (Alan Cox), hps@intermeta.de,
        linux-kernel@vger.kernel.org
In-Reply-To: <20011206001537.OPTF485.femail3.sdc1.sfba.home.com@there> from "Rob Landley" at Dec 05, 2001 09:23:40 AM
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From: Alan Cox <alan@lxorguk.ukuu.org.uk>
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> So either way, you wind up with SMP on one die.  (You can't make chips TOO 
> much smaller because it becomes less economical to cut the wafer up that 
> small.  Harvesting and connecting the chips at finer granularity increases 

Except for VIA (where they cant really make them much smaller) the
mainstream x86 dies are _gigantic_

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