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Message-ID: <d664db86-309e-5c84-b170-ac04616dc131@linaro.org>
Date:   Mon, 2 Jan 2023 10:33:36 +0100
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Subject: Re: [PATCH v2 1/2] dt-bindings: remoteproc: k3-dsp: update bindings
 for AM62A SoCs
To:     Hari Nagalla <hnagalla@ti.com>, andersson@kernel.org,
        devicetree@vger.kernel.org, mathieu.poirier@linaro.org,
        p.zabel@pengutronix.de, linux-remoteproc@vger.kernel.org,
        robh+dt@kernel.org, linux-kernel@vger.kernel.org,
        krzysztof.kozlowski+dt@linaro.org, s-anna@ti.com
Cc:     praneeth@ti.com, nm@ti.com, vigneshr@ti.com, a-bhatia1@ti.com,
        j-luthra@ti.com, devarsht@ti.com
References: <20221230132453.32022-1-hnagalla@ti.com>
 <20221230132453.32022-2-hnagalla@ti.com>
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From:   Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
In-Reply-To: <20221230132453.32022-2-hnagalla@ti.com>
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On 30/12/2022 14:24, Hari Nagalla wrote:
> The TI AM62A SoCs have a C7xv DSP and Analytics engine for deep
> learning purposes. The DSP part is similar to the C71x DSP found on
> K3 J7 SoCs, but additional hardware accelerators and IP are added to
> the subsystem for deep learning.
> 
> Compatible info is updated to match AM62A SoCs.
> 


Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>

Best regards,
Krzysztof