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From:   "Rafael J. Wysocki" <rafael@kernel.org>
Date:   Mon, 13 Feb 2023 16:38:17 +0100
Message-ID: <CAJZ5v0iEYtFJAh94w+K-T90PXLRDzyUgvb_OPL9aOvphTH2CGg@mail.gmail.com>
Subject: Re: [PATCH] thermal: Remove core header inclusion from drivers
To:     Daniel Lezcano <daniel.lezcano@linaro.org>
Cc:     rafael.j.wysocki@intel.com, linux-pm@vger.kernel.org,
        linux-kernel@vger.kernel.org,
        Guillaume La Roque <glaroque@baylibre.com>,
        "Rafael J. Wysocki" <rafael@kernel.org>,
        Amit Kucheria <amitk@kernel.org>,
        Zhang Rui <rui.zhang@intel.com>,
        Miquel Raynal <miquel.raynal@bootlin.com>,
        Florian Fainelli <f.fainelli@gmail.com>,
        Ray Jui <rjui@broadcom.com>,
        Scott Branden <sbranden@broadcom.com>,
        Broadcom internal kernel review list 
        <bcm-kernel-feedback-list@broadcom.com>,
        Shawn Guo <shawnguo@kernel.org>,
        Sascha Hauer <s.hauer@pengutronix.de>,
        Pengutronix Kernel Team <kernel@pengutronix.de>,
        Fabio Estevam <festevam@gmail.com>,
        NXP Linux Team <linux-imx@nxp.com>,
        Andy Gross <agross@kernel.org>,
        Bjorn Andersson <andersson@kernel.org>,
        Konrad Dybcio <konrad.dybcio@linaro.org>,
        Thara Gopinath <thara.gopinath@gmail.com>,
        =?UTF-8?Q?Niklas_S=C3=B6derlund?= <niklas.soderlund@ragnatech.se>,
        Bartlomiej Zolnierkiewicz <bzolnier@gmail.com>,
        Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>,
        Alim Akhtar <alim.akhtar@samsung.com>,
        Maxime Coquelin <mcoquelin.stm32@gmail.com>,
        Alexandre Torgue <alexandre.torgue@foss.st.com>,
        Thierry Reding <thierry.reding@gmail.com>,
        Jonathan Hunter <jonathanh@nvidia.com>,
        Kunihiko Hayashi <hayashi.kunihiko@socionext.com>,
        Masami Hiramatsu <mhiramat@kernel.org>,
        ye xingchen <ye.xingchen@zte.com.cn>,
        Ricardo Neri <ricardo.neri-calderon@linux.intel.com>,
        Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>,
        Haowen Bai <baihaowen@meizu.com>,
        Minghao Chi <chi.minghao@zte.com.cn>,
        "open list:THERMAL DRIVER FOR AMLOGIC SOCS" 
        <linux-amlogic@lists.infradead.org>,
        "moderated list:BROADCOM BCM2711/BCM2835 ARM ARCHITECTURE" 
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        <linux-arm-kernel@lists.infradead.org>,
        "open list:ARM/QUALCOMM SUPPORT" <linux-arm-msm@vger.kernel.org>,
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        <linux-stm32@st-md-mailman.stormreply.com>,
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On Fri, Feb 10, 2023 at 10:41 AM Daniel Lezcano
<daniel.lezcano@linaro.org> wrote:
>
> Hi Rafael,
>
> On Mon, Feb 06, 2023 at 04:34:29PM +0100, Daniel Lezcano wrote:
> > As the name states "thermal_core.h" is the header file for the core
> > components of the thermal framework.
> >
> > Too many drivers are including it. Hopefully the recent cleanups
> > helped to self encapsulate the code a bit more and prevented the
> > drivers to need this header.
> >
> > Remove this inclusion in every place where it is possible.
> >
> > Some other drivers did a confusion with the core header and the one
> > exported in linux/thermal.h. They include the former instead of the
> > latter. The changes also fix this.
> >
> > The tegra/soctherm driver still remains as it uses an internal
> > function which need to be replaced.
> >
> > The Intel HFI driver uses the netlink internal framework core and
> > should be changed to prevent to deal with the internals.
> >
> > No functional changes
>
> Are you ok if I take this patch ?

Well, you've already done that.