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References: <20230219143657.241542-1-daniel.lezcano@linaro.org> <20230219143657.241542-6-daniel.lezcano@linaro.org>
In-Reply-To: <20230219143657.241542-6-daniel.lezcano@linaro.org>
From:   Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Date:   Sun, 19 Feb 2023 18:26:22 +0100
Message-ID: <CAFBinCAm+pFuuJEL3_2B3o3ZaLWxb-JqHhxY0vJfb8ZfxKOieQ@mail.gmail.com>
Subject: Re: [PATCH v1 05/17] thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs()
To:     Daniel Lezcano <daniel.lezcano@linaro.org>
Cc:     rafael@kernel.org, linux-pm@vger.kernel.org,
        linux-kernel@vger.kernel.org,
        Guillaume La Roque <glaroque@baylibre.com>,
        Amit Kucheria <amitk@kernel.org>,
        Zhang Rui <rui.zhang@intel.com>,
        Shawn Guo <shawnguo@kernel.org>,
        Sascha Hauer <s.hauer@pengutronix.de>,
        Pengutronix Kernel Team <kernel@pengutronix.de>,
        Fabio Estevam <festevam@gmail.com>,
        NXP Linux Team <linux-imx@nxp.com>,
        Thara Gopinath <thara.gopinath@gmail.com>,
        Andy Gross <agross@kernel.org>,
        Bjorn Andersson <andersson@kernel.org>,
        Konrad Dybcio <konrad.dybcio@linaro.org>,
        Vasily Khoruzhick <anarsoul@gmail.com>,
        Yangtao Li <tiny.windzz@gmail.com>,
        Chen-Yu Tsai <wens@csie.org>,
        Jernej Skrabec <jernej.skrabec@gmail.com>,
        Samuel Holland <samuel@sholland.org>,
        Thierry Reding <thierry.reding@gmail.com>,
        Jonathan Hunter <jonathanh@nvidia.com>,
        Eduardo Valentin <edubezval@gmail.com>,
        Keerthy <j-keerthy@ti.com>,
        Matthias Brugger <matthias.bgg@gmail.com>,
        AngeloGioacchino Del Regno 
        <angelogioacchino.delregno@collabora.com>,
        Daniel Golle <daniel@makrotopia.org>,
        ye xingchen <ye.xingchen@zte.com.cn>,
        Randy Dunlap <rdunlap@infradead.org>,
        Balsam CHIHI <bchihi@baylibre.com>,
        Miquel Raynal <miquel.raynal@bootlin.com>,
        Kunihiko Hayashi <hayashi.kunihiko@socionext.com>,
        =?UTF-8?Q?Niklas_S=C3=B6derlund?= 
        <niklas.soderlund+renesas@ragnatech.se>,
        "open list:THERMAL DRIVER FOR AMLOGIC SOCS" 
        <linux-amlogic@lists.infradead.org>,
        "moderated list:ARM/FREESCALE IMX / MXC ARM ARCHITECTURE" 
        <linux-arm-kernel@lists.infradead.org>,
        "open list:QUALCOMM TSENS THERMAL DRIVER" 
        <linux-arm-msm@vger.kernel.org>,
        "open list:ARM/Allwinner sunXi SoC support" 
        <linux-sunxi@lists.linux.dev>,
        "open list:TEGRA ARCHITECTURE SUPPORT" <linux-tegra@vger.kernel.org>,
        "open list:TI BANDGAP AND THERMAL DRIVER" 
        <linux-omap@vger.kernel.org>,
        "moderated list:ARM/Mediatek SoC support" 
        <linux-mediatek@lists.infradead.org>
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On Sun, Feb 19, 2023 at 3:38 PM Daniel Lezcano
<daniel.lezcano@linaro.org> wrote:
>
> The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
> zone structure pointer as parameter.
>
> Actually, it uses the tz->device to add it in the devres list.
>
> It is preferable to use the device registering the thermal zone
> instead of the thermal zone device itself. That prevents the driver
> accessing the thermal zone structure internals and it is from my POV
> more correct regarding how devm_ is used.
>
> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
> ---
>  drivers/thermal/amlogic_thermal.c                  | 2 +-
For amlogic_thermal.c:
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>