Date:   Sat, 25 Feb 2023 17:11:39 +0000
From:   Jonathan Cameron <jic23@kernel.org>
To:     <marius.cristea@microchip.com>
Cc:     <lars@metafoo.de>, <robh+dt@kernel.org>,
        <linux-iio@vger.kernel.org>, <devicetree@vger.kernel.org>,
        <linux-kernel@vger.kernel.org>
Subject: Re: [PATCH v1 0/2] adding support for Microchip PAC193X Power
 Monitor
Message-ID: <20230225171139.65238b62@jic23-huawei>
In-Reply-To: <20230220123232.413029-1-marius.cristea@microchip.com>
References: <20230220123232.413029-1-marius.cristea@microchip.com>
MIME-Version: 1.0
Content-Type: text/plain; charset=US-ASCII
Content-Transfer-Encoding: 7bit
Precedence: bulk

On Mon, 20 Feb 2023 14:32:30 +0200
<marius.cristea@microchip.com> wrote:

> From: Marius Cristea <marius.cristea@microchip.com>
> 
> Adding support for Microchip PAC193X series of Power Monitor with
> Accumulator chip family.

This device is at the messy boundary between IIO and HWMON. Perhaps call out
the reasons you think IIO is more appropriate in this cover letter.
+ Often a good idea for these borderline parts to cc both mailing lists and
maintainers.

Often the conclusion is that it is fine to have these in IIO because we can
bridge to hwmon anyway with the iio-hwmon driver.

> 
> Differences related to previous patch:
> 
> v1:
> - first version comitted to review
> 
> 
> Marius Cristea (2):
>   dt-bindings: iio: adc: adding dt-bindings for PAC193X
>   iio: adc: adding support for pac193x
> 
>  .../bindings/iio/adc/microchip,pac193x.yaml   |  122 +
>  MAINTAINERS                                   |    7 +
>  drivers/iio/adc/Kconfig                       |   12 +
>  drivers/iio/adc/Makefile                      |    1 +
>  drivers/iio/adc/pac193x.c                     | 2072 +++++++++++++++++
>  5 files changed, 2214 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/iio/adc/microchip,pac193x.yaml
>  create mode 100644 drivers/iio/adc/pac193x.c
>