From:   Heiko =?ISO-8859-1?Q?St=FCbner?= <heiko@sntech.de>
To:     rafael@kernel.org, daniel.lezcano@linaro.org,
        Daniel Lezcano <daniel.lezcano@linaro.org>
Cc:     linux-pm@vger.kernel.org, linux-kernel@vger.kernel.org,
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Subject: Re: [PATCH v5 02/18] thermal/core: Use the thermal zone 'devdata' accessor in
 thermal located drivers
Date:   Fri, 03 Mar 2023 16:47:15 +0100
Message-ID: <3152081.5fSG56mABF@diego>
In-Reply-To: <20230301201446.3713334-3-daniel.lezcano@linaro.org>
References: <20230301201446.3713334-1-daniel.lezcano@linaro.org>
 <20230301201446.3713334-3-daniel.lezcano@linaro.org>
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Am Mittwoch, 1. M?rz 2023, 21:14:30 CET schrieb Daniel Lezcano:
> The thermal zone device structure is exposed to the different drivers
> and obviously they access the internals while that should be
> restricted to the core thermal code.
> 
> In order to self-encapsulate the thermal core code, we need to prevent
> the drivers accessing directly the thermal zone structure and provide
> accessor functions to deal with.
> 
> Use the devdata accessor introduced in the previous patch.
> 
> No functional changes intended.
> 
> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
> Reviewed-by: Niklas S?derlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
> Acked-by: Mark Brown <broonie@kernel.org>
> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
> Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
> Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
> Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com>  #spread
> Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
> Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
> Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
> Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap

Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip