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Date:   Thu, 28 Sep 2023 09:10:26 +0200
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Subject: Re: [PATCH v1 10/13] thermal: core: Allow trip pointers to be used
 for cooling device binding
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To:     "Rafael J. Wysocki" <rjw@rjwysocki.net>,
        Linux PM <linux-pm@vger.kernel.org>
Cc:     LKML <linux-kernel@vger.kernel.org>,
        Linux ACPI <linux-acpi@vger.kernel.org>,
        Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>,
        Zhang Rui <rui.zhang@intel.com>,
        Lukasz Luba <lukasz.luba@arm.com>,
        "Rafael J. Wysocki" <rafael@kernel.org>
References: <1957441.PYKUYFuaPT@kreacher> <45837158.fMDQidcC6G@kreacher>
From:   Daniel Lezcano <daniel.lezcano@linaro.org>
In-Reply-To: <45837158.fMDQidcC6G@kreacher>
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On 21/09/2023 20:01, Rafael J. Wysocki wrote:
> From: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
> 
> Add new helper functions, thermal_bind_cdev_to_trip() and
> thermal_unbind_cdev_from_trip(), to allow a trip pointer to be used for
> binding a cooling device to a trip point and unbinding it, respectively,
> and redefine the existing helpers, thermal_zone_bind_cooling_device()
> and thermal_zone_unbind_cooling_device(), as wrappers around the new
> ones, respectively.
> 
> No intentional functional impact.
> 
> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
> ---

Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>


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