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From:   "Rafael J. Wysocki" <rafael@kernel.org>
Date:   Fri, 13 Oct 2023 11:43:42 +0200
Message-ID: <CAJZ5v0gxd3hCOAVXGnKZc=arfoV6=9OQVDuHFP6xkHMk9o1hEQ@mail.gmail.com>
Subject: Re: [PATCH 1/2] thermal/core: Hardening the self-encapsulation
To:     Daniel Lezcano <daniel.lezcano@linaro.org>
Cc:     "Rafael J. Wysocki" <rafael@kernel.org>,
        Lukasz Luba <lukasz.luba@arm.com>,
        Thierry Reding <thierry.reding@gmail.com>,
        Amit Kucheria <amitk@kernel.org>,
        Zhang Rui <rui.zhang@intel.com>,
        "open list:THERMAL" <linux-pm@vger.kernel.org>,
        open list <linux-kernel@vger.kernel.org>
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On Thu, Oct 12, 2023 at 11:13 PM Daniel Lezcano
<daniel.lezcano@linaro.org> wrote:
>
> On 12/10/2023 19:44, Rafael J. Wysocki wrote:
>
> [ ... ]
>
> >> Yes, we should but there is the series for nvidia (pointed in the
> >> changelog) which need a slight refresh for the bindings AFAIR. That
> >> series is since March 2023 and Thierry seems busy [1]. I'm holding the
> >> hardening since then.
> >>
> >> So I don't know how to make progress on this? I was assuming we can
> >> merge this series and let the compiler recall what has to be fixed.
> >>
> >> [1] https://lore.kernel.org/all/ZK14edZUih1kH_sZ@orome/
> >>
> >> and as soon as it is fixed, we convert the WARNING to ERROR :P
> >
> > To be honest, I'm not sure if anything needs to be done along the
> > lines of this patch right now or even at all.
> >
> > The only concern here would be that some new drivers would include
> > thermal_core.h while we were waiting for the remaining existing
> > abusers to be fixed, but since this hasn't happened for the last 6
> > months, I'm not worried.
> >
> > It would be good to add a notice to thermal_core.h that this file is
> > for internal use in the thermal core only, though.
>
> So this series will give a warning for the remaining nvidia driver but
> Thierry just send the changes to get rid of the thermal_core.h (Thanks!)
>
> AFAICT, the last user of the thermal_zone_device structure is the
> int340x driver but the patch fixing the structure internal usage is
> already in the bleeding edge (well perhaps one nit is missing for the trace)
>
> As soon as the bindings are acked, then I can pick the patches from
> Thierry which will end up in your tree. Then you can apply the current
> series. And finally I'll send the last patch moving the thermal zone
> device structure to the thermal_core.h. And we will be done with this part.

OK

> Having a compilation warning (I would prefer a more coercive error if we
> agree on that) will help to not have to double check every time
> thermal_core.h is not pulled in the drivers when patches are submitted.

Well, at least it doesn't hurt to have it.