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From:   Johan Hovold <johan+linaro@kernel.org>
To:     Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc:     Andy Gross <agross@kernel.org>,
        Bjorn Andersson <andersson@kernel.org>,
        Konrad Dybcio <konrad.dybcio@linaro.org>,
        Thinh Nguyen <Thinh.Nguyen@synopsys.com>,
        Krishna Kurapati PSSNV <quic_kriskura@quicinc.com>,
        linux-arm-msm@vger.kernel.org, linux-usb@vger.kernel.org,
        linux-kernel@vger.kernel.org,
        Johan Hovold <johan+linaro@kernel.org>
Subject: [PATCH 0/3] USB: dwc3: qcom: fix resource leaks on probe deferral
Date:   Fri, 17 Nov 2023 18:36:47 +0100
Message-ID: <20231117173650.21161-1-johan+linaro@kernel.org>
MIME-Version: 1.0
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When reviewing the recently submitted series which reworks the dwc3 qcom
glue implementation [1], I noticed that the driver's tear down handling
is currently broken, something which can lead to memory leaks and
potentially use-after-free issues on probe deferral and on driver
unbind.

Let's get this sorted before reworking driver.

Note that the last patch has only been compile tested as I don't have
access to a sdm845 device.

Johan

[1] https://lore.kernel.org/lkml/20231016-dwc3-refactor-v1-0-ab4a84165470@quicinc.com/


Johan Hovold (3):
  USB: dwc3: qcom: fix resource leaks on probe deferral
  USB: dwc3: qcom: fix software node leak on probe errors
  USB: dwc3: qcom: fix ACPI platform device leak

 drivers/usb/dwc3/dwc3-qcom.c | 57 +++++++++++++++++++++++++++---------
 1 file changed, 43 insertions(+), 14 deletions(-)

-- 
2.41.0