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Date: Tue, 19 Dec 2023 15:16:29 +0800
From: kernel test robot <lkp@intel.com>
To: Daniel Lezcano <daniel.lezcano@linaro.org>, rjw@rjwysocki.net,
	lukasz.luba@arm.com
Cc: llvm@lists.linux.dev, oe-kbuild-all@lists.linux.dev,
	rui.zhang@intel.com, linux-kernel@vger.kernel.org,
	linux-pm@vger.kernel.org, "Rafael J. Wysocki" <rafael@kernel.org>
Subject: Re: [PATCH v2 1/2] thermal/debugfs: Add thermal cooling device
 debugfs information
Message-ID: <202312191425.5o49Dzmt-lkp@intel.com>
References: <20231218171942.3048095-1-daniel.lezcano@linaro.org>
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In-Reply-To: <20231218171942.3048095-1-daniel.lezcano@linaro.org>

Hi Daniel,

kernel test robot noticed the following build warnings:

[auto build test WARNING on rafael-pm/thermal]
[also build test WARNING on linus/master v6.7-rc6 next-20231218]
[If your patch is applied to the wrong git tree, kindly drop us a note.
And when submitting patch, we suggest to use '--base' as documented in
https://git-scm.com/docs/git-format-patch#_base_tree_information]

url:    https://github.com/intel-lab-lkp/linux/commits/Daniel-Lezcano/thermal-debugfs-Add-thermal-debugfs-information-for-mitigation-episodes/20231219-012118
base:   https://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm.git thermal
patch link:    https://lore.kernel.org/r/20231218171942.3048095-1-daniel.lezcano%40linaro.org
patch subject: [PATCH v2 1/2] thermal/debugfs: Add thermal cooling device debugfs information
config: x86_64-allyesconfig (https://download.01.org/0day-ci/archive/20231219/202312191425.5o49Dzmt-lkp@intel.com/config)
compiler: clang version 16.0.4 (https://github.com/llvm/llvm-project.git ae42196bc493ffe877a7e3dff8be32035dea4d07)
reproduce (this is a W=1 build): (https://download.01.org/0day-ci/archive/20231219/202312191425.5o49Dzmt-lkp@intel.com/reproduce)

If you fix the issue in a separate patch/commit (i.e. not just a new version of
the same patch/commit), kindly add following tags
| Reported-by: kernel test robot <lkp@intel.com>
| Closes: https://lore.kernel.org/oe-kbuild-all/202312191425.5o49Dzmt-lkp@intel.com/

All warnings (new ones prefixed by >>):

>> drivers/thermal/thermal_debugfs.c:73: warning: cannot understand function prototype: 'struct cdev_value '
>> drivers/thermal/thermal_debugfs.c:91: warning: cannot understand function prototype: 'struct thermal_debugfs '
>> drivers/thermal/thermal_debugfs.c:370: warning: bad line: 


vim +73 drivers/thermal/thermal_debugfs.c

    60	
    61	/**
    62	 * cdev_value - Common structure for cooling device entry
    63	 *
    64	 * The following common structure allows to store the information
    65	 * related to the transitions and to the state residencies. They are
    66	 * identified with a id which is associated to a value. It is used as
    67	 * nodes for the "transitions" and "durations" above.
    68	 *
    69	 * @node: node to insert the structure in a list
    70	 * @id: identifier of the value which can be a state or a transition
    71	 * @value: the id associated value which can be a duration or an occurrence
    72	 */
  > 73	struct cdev_value {
    74		struct list_head node;
    75		int id;
    76		u64 value;
    77	};
    78	
    79	/**
    80	 * thermal_debugfs - High level structure for a thermal object in
    81	 * debugfs
    82	 *
    83	 * The thermal_debugfs structure is the common structure used by the
    84	 * cooling device to compute the statistics.
    85	 *
    86	 * @d_top: top directory of the thermal object directory
    87	 * @lock: per object lock to protect the internals
    88	 *
    89	 * @cdev: a cooling device debug structure
    90	 */
  > 91	struct thermal_debugfs {
    92		struct dentry *d_top;
    93		struct mutex lock;
    94		union {
    95			struct cdev_debugfs cdev;
    96		};
    97	};
    98	

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