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From: Alexey Charkov <alchark@gmail.com>
Date: Wed, 31 Jan 2024 13:56:02 +0400
Message-ID: <CABjd4Ywx4-3BN7tF=Lv6LNTry_+j=jjM_v7SdzLaWHbuePip3g@mail.gmail.com>
Subject: Re: [PATCH v2 1/4] arm64: dts: rockchip: enable built-in thermal
 monitoring on rk3588
To: Dragan Simic <dsimic@manjaro.org>
Cc: Rob Herring <robh+dt@kernel.org>, 
	Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>, Conor Dooley <conor+dt@kernel.org>, 
	Heiko Stuebner <heiko@sntech.de>, Daniel Lezcano <daniel.lezcano@linaro.org>, 
	Viresh Kumar <viresh.kumar@linaro.org>, devicetree@vger.kernel.org, 
	linux-arm-kernel@lists.infradead.org, linux-rockchip@lists.infradead.org, 
	linux-kernel@vger.kernel.org
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On Wed, Jan 31, 2024 at 9:05=E2=80=AFAM Dragan Simic <dsimic@manjaro.org> w=
rote:
>
> Hello Alexey,
>
> Some small nitpicks below, please have a look.
>
> On 2024-01-30 19:21, Alexey Charkov wrote:
> > Include thermal zones information in device tree for rk3588 variants
>
> Please use "RK3588" instead of "rk3588", both here and in the
> patch subject.  Looks much better.

Noted, thanks!

> > Signed-off-by: Alexey Charkov <alchark@gmail.com>
> > ---
> >  arch/arm64/boot/dts/rockchip/rk3588s.dtsi | 162
> > ++++++++++++++++++++++++++++++
> >  1 file changed, 162 insertions(+)
> >
> > diff --git a/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
> > b/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
> > index 36b1b7acfe6a..696cb72d75d0 100644
> > --- a/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
> > +++ b/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
> > @@ -10,6 +10,7 @@
> >  #include <dt-bindings/reset/rockchip,rk3588-cru.h>
> >  #include <dt-bindings/phy/phy.h>
> >  #include <dt-bindings/ata/ahci.h>
> > +#include <dt-bindings/thermal/thermal.h>
> >
> >  / {
> >       compatible =3D "rockchip,rk3588";
> > @@ -2228,6 +2229,167 @@ tsadc: tsadc@fec00000 {
> >               status =3D "disabled";
> >       };
> >
> > +     thermal_zones: thermal-zones {
> > +             /* sensor near the center of the whole chip */
>
> It would be good to replace "whole chip" with "SoC".  Simpler and
> IIRC closer to the official description of the sensor.

The TRM only says "near chip center" (sic) :)

> > +             package_thermal: package-thermal {
> > +                     polling-delay-passive =3D <0>;
> > +                     polling-delay =3D <0>;
> > +                     thermal-sensors =3D <&tsadc 0>;
> > +
> > +                     trips {
> > +                             package_crit: package-crit {
> > +                                     temperature =3D <115000>;
> > +                                     hysteresis =3D <0>;
> > +                                     type =3D "critical";
> > +                             };
> > +                     };
> > +             };
> > +
> > +             /* sensor between A76 cores 0 and 1 */
> > +             bigcore0_thermal: bigcore0-thermal {
> > +                     polling-delay-passive =3D <100>;
> > +                     polling-delay =3D <0>;
> > +                     thermal-sensors =3D <&tsadc 1>;
> > +
> > +                     trips {
>
> Please add the following comment here, to make it clear what's
> the purpose of this thermal trip when the IPA thermal governor
> is used (more similar comments below):
>
>                                  /* IPA threshold */

Not so sure about this one: shouldn't the device tree be
implementation agnostic, and just describe the hardware and its
expectations? Sounds like references to a particular thermal governor
would be out of scope.

Best regards,
Alexey

> > +                             bigcore0_alert0: bigcore0-alert0 {
> > +                                     temperature =3D <75000>;
> > +                                     hysteresis =3D <2000>;
> > +                                     type =3D "passive";
> > +                             };
>
> Please add the following comment here:
>
>                                  /* IPA target */
>
> > +                             bigcore0_alert1: bigcore0-alert1 {
> > +                                     temperature =3D <85000>;
> > +                                     hysteresis =3D <2000>;
> > +                                     type =3D "passive";
> > +                             };
> > +                             bigcore0_crit: bigcore0-crit {
> > +                                     temperature =3D <115000>;
> > +                                     hysteresis =3D <0>;
> > +                                     type =3D "critical";
> > +                             };
> > +                     };
> > +                     cooling-maps {
> > +                             map0 {
> > +                                     trip =3D <&bigcore0_alert1>;
> > +                                     cooling-device =3D
> > +                                             <&cpu_b0 THERMAL_NO_LIMIT=
 THERMAL_NO_LIMIT>,
> > +                                             <&cpu_b1 THERMAL_NO_LIMIT=
 THERMAL_NO_LIMIT>;
> > +                             };
> > +                     };
> > +             };
> > +
> > +             /* sensor between A76 cores 2 and 3 */
> > +             bigcore2_thermal: bigcore2-thermal {
> > +                     polling-delay-passive =3D <100>;
> > +                     polling-delay =3D <0>;
> > +                     thermal-sensors =3D <&tsadc 2>;
> > +
> > +                     trips {
>
> Please add the following comment here:
>
>                                  /* IPA threshold */
>
> > +                             bigcore2_alert0: bigcore2-alert0 {
> > +                                     temperature =3D <75000>;
> > +                                     hysteresis =3D <2000>;
> > +                                     type =3D "passive";
> > +                             };
>
> Please add the following comment here:
>
>                                  /* IPA target */
>
> > +                             bigcore2_alert1: bigcore2-alert1 {
> > +                                     temperature =3D <85000>;
> > +                                     hysteresis =3D <2000>;
> > +                                     type =3D "passive";
> > +                             };
> > +                             bigcore2_crit: bigcore2-crit {
> > +                                     temperature =3D <115000>;
> > +                                     hysteresis =3D <0>;
> > +                                     type =3D "critical";
> > +                             };
> > +                     };
> > +                     cooling-maps {
> > +                             map0 {
> > +                                     trip =3D <&bigcore2_alert1>;
> > +                                     cooling-device =3D
> > +                                             <&cpu_b2 THERMAL_NO_LIMIT=
 THERMAL_NO_LIMIT>,
> > +                                             <&cpu_b3 THERMAL_NO_LIMIT=
 THERMAL_NO_LIMIT>;
> > +                             };
> > +                     };
> > +             };
> > +
> > +             /* sensor between the four A55 cores */
> > +             little_core_thermal: littlecore-thermal {
> > +                     polling-delay-passive =3D <100>;
> > +                     polling-delay =3D <0>;
> > +                     thermal-sensors =3D <&tsadc 3>;
> > +
> > +                     trips {
>
> Please add the following comment here:
>
>                                  /* IPA threshold */
>
> > +                             littlecore_alert0: littlecore-alert0 {
> > +                                     temperature =3D <75000>;
> > +                                     hysteresis =3D <2000>;
> > +                                     type =3D "passive";
> > +                             };
>
> Please add the following comment here:
>
>                                  /* IPA target */
>
> > +                             littlecore_alert1: littlecore-alert1 {
> > +                                     temperature =3D <85000>;
> > +                                     hysteresis =3D <2000>;
> > +                                     type =3D "passive";
> > +                             };
> > +                             littlecore_crit: littlecore-crit {
> > +                                     temperature =3D <115000>;
> > +                                     hysteresis =3D <0>;
> > +                                     type =3D "critical";
> > +                             };
> > +                     };
> > +                     cooling-maps {
> > +                             map0 {
> > +                                     trip =3D <&littlecore_alert1>;
> > +                                     cooling-device =3D
> > +                                             <&cpu_l0 THERMAL_NO_LIMIT=
 THERMAL_NO_LIMIT>,
> > +                                             <&cpu_l1 THERMAL_NO_LIMIT=
 THERMAL_NO_LIMIT>,
> > +                                             <&cpu_l2 THERMAL_NO_LIMIT=
 THERMAL_NO_LIMIT>,
> > +                                             <&cpu_l3 THERMAL_NO_LIMIT=
 THERMAL_NO_LIMIT>;
> > +                             };
> > +                     };
> > +             };
> > +
> > +             /* sensor near the PD_CENTER power domain */
> > +             center_thermal: center-thermal {
> > +                     polling-delay-passive =3D <0>;
> > +                     polling-delay =3D <0>;
> > +                     thermal-sensors =3D <&tsadc 4>;
> > +
> > +                     trips {
> > +                             center_crit: center-crit {
> > +                                     temperature =3D <115000>;
> > +                                     hysteresis =3D <0>;
> > +                                     type =3D "critical";
> > +                             };
> > +                     };
> > +             };
> > +
> > +             gpu_thermal: gpu-thermal {
> > +                     polling-delay-passive =3D <0>;
> > +                     polling-delay =3D <0>;
> > +                     thermal-sensors =3D <&tsadc 5>;
> > +
> > +                     trips {
> > +                             gpu_crit: gpu-crit {
> > +                                     temperature =3D <115000>;
> > +                                     hysteresis =3D <0>;
> > +                                     type =3D "critical";
> > +                             };
> > +                     };
> > +             };
> > +
> > +             npu_thermal: npu-thermal {
> > +                     polling-delay-passive =3D <0>;
> > +                     polling-delay =3D <0>;
> > +                     thermal-sensors =3D <&tsadc 6>;
> > +
> > +                     trips {
> > +                             npu_crit: npu-crit {
> > +                                     temperature =3D <115000>;
> > +                                     hysteresis =3D <0>;
> > +                                     type =3D "critical";
> > +                             };
> > +                     };
> > +             };
> > +     };
> > +
> >       saradc: adc@fec10000 {
> >               compatible =3D "rockchip,rk3588-saradc";
> >               reg =3D <0x0 0xfec10000 0x0 0x10000>;