Received-SPF: pass (google.com: domain of linux-kernel+bounces-49630-linux.lists.archive=gmail.com@vger.kernel.org designates 2604:1380:45e3:2400::1 as permitted sender) client-ip=2604:1380:45e3:2400::1;
Message-ID: <923499c2-1a60-42dc-b0e2-3f7d78de9d8a@collabora.com>
Date: Fri, 2 Feb 2024 10:58:15 +0100
Precedence: bulk
MIME-Version: 1.0
User-Agent: Mozilla Thunderbird
Subject: Re: [PATCH v1 00/18] Thermal: Part 1 - Introduce new structs and
 registration
Content-Language: en-US
To: "Rafael J. Wysocki" <rafael@kernel.org>
Cc: daniel.lezcano@linaro.org, miquel.raynal@bootlin.com,
 rui.zhang@intel.com, lukasz.luba@arm.com, support.opensource@diasemi.com,
 shawnguo@kernel.org, s.hauer@pengutronix.de, kernel@pengutronix.de,
 festevam@gmail.com, linux-imx@nxp.com, andersson@kernel.org,
 konrad.dybcio@linaro.org, amitk@kernel.org, thara.gopinath@gmail.com,
 niklas.soderlund@ragnatech.se, srinivas.pandruvada@linux.intel.com,
 baolin.wang@linux.alibaba.com, u.kleine-koenig@pengutronix.de,
 hayashi.kunihiko@socionext.com, d-gole@ti.com, linus.walleij@linaro.org,
 DLG-Adam.Ward.opensource@dm.renesas.com, error27@gmail.com, heiko@sntech.de,
 hdegoede@redhat.com, jernej.skrabec@gmail.com, f.fainelli@gmail.com,
 bchihi@baylibre.com, linux-pm@vger.kernel.org, linux-kernel@vger.kernel.org,
 linux-arm-kernel@lists.infradead.org, linux-arm-msm@vger.kernel.org,
 linux-renesas-soc@vger.kernel.org, kernel@collabora.com
References: <20240130111250.185718-1-angelogioacchino.delregno@collabora.com>
 <CAJZ5v0haFEGOjaMC4a8CZbQe+cxFfaB1hD60NkN297NY2TZB5A@mail.gmail.com>
From: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
In-Reply-To: <CAJZ5v0haFEGOjaMC4a8CZbQe+cxFfaB1hD60NkN297NY2TZB5A@mail.gmail.com>
Content-Type: text/plain; charset=UTF-8; format=flowed
Content-Transfer-Encoding: 8bit

Il 01/02/24 19:35, Rafael J. Wysocki ha scritto:
> On Tue, Jan 30, 2024 at 12:13 PM AngeloGioacchino Del Regno
> <angelogioacchino.delregno@collabora.com> wrote:
>>
>> This series is a preparation for a bigger cleanup that will be split in
>> three parts in order to avoid immutable branches on multiple subsystems,
>> as in other parts of this series there will be changes in:
>> - drivers/acpi
>> - drivers/platform/x86
>> - drivers/power/supply
>> - drivers/net/wireless
>> - drivers/net/ethernet
>>
>> This is the first part which adds new structures and starts reorganizing
>> struct members around, plus, this migrates all of the thermal drivers
>> found in drivers/thermal/ to the new thermal_zone_device_register()
>> function, and advertises that the old registration functions are
>> deprecated and will be removed.
>>
>> The reorganization is supposed to be complete (or mostly) but...
>>   - struct thermal_zone_platform_params has a temporary name:
>>     this is done in order to avoid compile time failures for
>>     the drivers outside of drivers/thermal before migrating
>>     them to thermal_zone_device_params/thermal_zone_device_register();
>>   - struct thermal_zone_params temporarily has two duplicated members,
>>     governor_name and no_hwmon;
>>
>> Part 2 of this topic will migrate all drivers that are external to
>> drivers/thermal to thermal_zone_device_register(); I will send that
>> part only after part 1 is confirmed to be acceptable, as otherwise
>> I'd be spamming people for no reason :-)
>>
>> After all drivers will be migrated to thermal_zone_device_register(),
>> we won't have to care about changing anything outside of drivers/thermal
>> to finish this set of cleanups/changes (and no immutable branches needed)
>> and this means that...
>> Part 3 of this topic will contain the following changes:
>>   - thermal_zone_device_register_with_trips() will be removed
>>   - thermal_tripless_zone_device_register() will be removed
>>   - thermal_zone_params will be renamed to thermal_governor_ipa_params
>>     - governor_name, no_hwmon members will be removed
>>   - thermal_zone_platform_params will be renamed to thermal_zone_params
>>   - Removal of the THERMAL_NAME_LENGTH limitation for `type`
>>
>> More scheduled changes, which should end up in part 3 (at least that's
>> my intention), or eventually entirely after this cleanup topic, include:
>>   - Introduction of Thermal Zone names
>>   - Disambiguation of TZ name and type
>>   - Addition of `thermal-zones`, `thermal-zone-names` parsing for
>>     devicetrees
> 
> You really should start with this, because that's your goal.
> 
> It is quite arguable that it can be achieved without making all of the
> changes mentioned above.
> 

Actually, my initial idea was exactly that... but then there were some
discussions around it, please check [1] for the thermal-zone-names, and
[2] for the rest of the discussion.

[1]: https://lore.kernel.org/all/8d42e0f5-b2d2-471b-ada9-79f76c637abe@collabora.com/

[2]: https://lore.kernel.org/all/4dd4ac79-e8bc-4d88-92d6-6061dae42092@collabora.com/

>>
>> ... Summarizing ...
>>
>> Part 1:
>>   - Reorganize structures (some temporary names/leftovers)
>>   - New registration function, deprecation of old ones
>>   - Migration of drivers/thermal drivers to new registration
> 
> I kind of see where this is going, but I don't agree with some of the
> changes made.
> 
> Let me comment on individual patches (which is not necessarily going
> to happen today or even tomorrow, so let me go through the entire
> series before deciding what to do next).
> 

Sure, thanks for your feedback!

Cheers,
Angelo