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Date: Fri, 14 Jun 2024 20:51:51 +0200
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Subject: Re: [PATCH] dt-bindings: thermal: convert hisilicon-thermal.txt to
 dt-schema
To: Krzysztof Kozlowski <krzk@kernel.org>,
 Abdulrasaq Lawani <abdulrasaqolawani@gmail.com>, rafael@kernel.org,
 daniel.lezcano@linaro.org, rui.zhang@intel.com, lukasz.luba@arm.com,
 robh@kernel.org, krzk+dt@kernel.org, conor+dt@kernel.org
Cc: linux-pm@vger.kernel.org, devicetree@vger.kernel.org,
 linux-kernel@vger.kernel.org, skhan@linuxfoundation.org
References: <20240613224204.185844-1-abdulrasaqolawani@gmail.com>
 <afb7551e-404e-440b-92c5-6927c61417ab@kernel.org>
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From: Javier Carrasco <javier.carrasco.cruz@gmail.com>
In-Reply-To: <afb7551e-404e-440b-92c5-6927c61417ab@kernel.org>
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On 14/06/2024 10:49, Krzysztof Kozlowski wrote:
> On 14/06/2024 00:42, Abdulrasaq Lawani wrote:
>> Convert the hisilicon SoCs tsensor txt bindings to dt-schema
>>
>> Signed-off-by: Abdulrasaq Lawani <abdulrasaqolawani@gmail.com>
>> ---
>> Validated with dtschema and tested against `hi3660-hikey960.dts`
>>
> 
>> +     compatible = "hisilicon,tsensor";
>> +     reg = <0x0 0xf7030700 0x0 0x1000>;
> 
> Oh man...  get this past your mentors first.
> 
> 1. Messed indentation.
> 2. 0, unit address looks unnecessary.
> 

Sorry Krzysztof, it seems that this conversion went "live" without a
preliminary review by the mentors. We will make sure that the first step
is not omitted for v2.

Best regards,
Javier Carrasco