Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1754108Ab2BCHMf (ORCPT ); Fri, 3 Feb 2012 02:12:35 -0500 Received: from mga03.intel.com ([143.182.124.21]:16432 "EHLO mga03.intel.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1753831Ab2BCHMe (ORCPT ); Fri, 3 Feb 2012 02:12:34 -0500 X-ExtLoop1: 1 X-IronPort-AV: E=Sophos;i="4.71,315,1320652800"; d="scan'208";a="62814478" Message-ID: <1328253147.20438.19.camel@rui.sh.intel.com> Subject: Re: [RFC PATCH 0/2] thermal: Add generic cpu cooling devices according to thermal framework From: Zhang Rui To: Amit Kachhap Cc: linux-pm@lists.linux-foundation.org, linux-kernel@vger.kernel.org, mjg59@srcf.ucam.org, linux-acpi@vger.kernel.org, lenb@kernel.org, linaro-dev@lists.linaro.org, patches@linaro.org Date: Fri, 03 Feb 2012 15:12:27 +0800 In-Reply-To: References: <1323789196-4942-1-git-send-email-amit.kachhap@linaro.org> Content-Type: text/plain; charset="UTF-8" X-Mailer: Evolution 3.2.2 (3.2.2-1.fc16) Content-Transfer-Encoding: 8bit Mime-Version: 1.0 Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Content-Length: 2942 Lines: 72 Hi, sorry for the late response. On 四, 2012-01-19 at 14:47 +0530, Amit Kachhap wrote: > On 13 December 2011 20:43, Amit Daniel Kachhap wrote: > > PATCH 1) [thermal: Add a new trip type to use cooling device instance number] > > This patch adds a new trip type THERMAL_TRIP_STATE_ACTIVE which passes > > cooling device instance number and may be helpful for cpufreq cooling devices > > to take the correct cooling action. > > Sorry, I'm still not quite clear about how this will be used. Say, processor has P0~P3, then we need to register a thermal zone with three STATE_ACTIVE trip points, like the picture shown below? processor in full speed, i.e. P0 ---------------------------- state active trip point 1 ---------------------------- processor in P1 ---------------------------- state active trip point 2 ---------------------------- processor in P2 ---------------------------- state active trip point 3 ---------------------------- processor in P3 > > PATCH 2) [thermal: Add generic cpu cooling implementation] > > This patch adds generic cpu cooling low level implementation through frequency > > clipping and cpu hotplug. In future, other cpu related cooling devices may be > > added here. An ACPI version of this already exists(drivers/acpi/processor_thermal.c). > > But this will be useful for platforms like ARM using the generic thermal interface > > along with the generic cpu cooling devices. The cooling device registration API's > > return cooling device pointers which can be easily binded with the thermal zone > > trip points. > > It seems that we can convert the ACPI processor thermal driver to follow this generic cpu cooling implementation, right? thanks, rui > > Any comments on these patches? I submitted them quite long back. > > Regards, > Amit D > > > > > Amit Daniel Kachhap (2): > > thermal: Add a new trip type to use cooling device instance number > > thermal: Add generic cpu cooling implementation > > > > Documentation/thermal/cpu-cooling-api.txt | 52 +++++ > > Documentation/thermal/sysfs-api.txt | 4 +- > > drivers/thermal/Kconfig | 11 + > > drivers/thermal/Makefile | 1 + > > drivers/thermal/cpu_cooling.c | 302 +++++++++++++++++++++++++++++ > > drivers/thermal/thermal_sys.c | 27 +++- > > include/linux/cpu_cooling.h | 45 +++++ > > include/linux/thermal.h | 1 + > > 8 files changed, 440 insertions(+), 3 deletions(-) > > create mode 100644 Documentation/thermal/cpu-cooling-api.txt > > create mode 100644 drivers/thermal/cpu_cooling.c > > create mode 100644 include/linux/cpu_cooling.h > > -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/