Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1754008Ab2JPLpz (ORCPT ); Tue, 16 Oct 2012 07:45:55 -0400 Received: from mail-pa0-f46.google.com ([209.85.220.46]:60770 "EHLO mail-pa0-f46.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1752038Ab2JPLpy (ORCPT ); Tue, 16 Oct 2012 07:45:54 -0400 From: "hongbo.zhang" To: linaro-dev@lists.linaro.org, linux-kernel@vger.kernel.org, linux-pm@vger.kernel.org Cc: patches@linaro.org, linaro-kernel@lists.linaro.org, STEricsson_nomadik_linux@list.st.com, kernel@igloocommunity.org, "hongbo.zhang" Subject: [PATCH 0/5] Fix thermal bugs and Upstream ST-Ericsson thermal driver Date: Tue, 16 Oct 2012 19:44:44 +0800 Message-Id: <1350387889-15324-1-git-send-email-hongbo.zhang@linaro.com> X-Mailer: git-send-email 1.7.11.3 Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Content-Length: 2851 Lines: 69 From: "hongbo.zhang" Hi all, This patch set is to upstream ST-Ericsson thermal driver and fix some bugs of thermal layer at the same time. All of these patches are based on v3.7-rc1. [PATCH 1/5] Thermal: do bind operation after thermal zone or cooling device register returns. In the previous bind function, cdev->get_max_state(cdev, &max_state) is called before the registration function finishes, but at this moment, the parameter cdev at thermal driver layer isn't ready--it will get ready only after its registration, so the the get_max_state callback cannot tell the max_state according to the cdev input. This problem can be fixed by separating the bind operation out of registration and doing it when registration completely finished. There is no such problem with the current exynos thermal driver because it regsters cooling device before thermal zone device. As a generic thermal layer any sequence should be supported, thermal zone first or cooling device first, this will be also helpful to add/remove cooling device dynamically. [PATCH 2/5] Thermal: add indent for code alignment. [PATCH 3/5] Thermal: fix empty list checking method. [PATCH 4/5] Thermal: make sure cpufreq cooling register after cpufreq driver Bug fix for generic cpufreq cooling layer as described in the commit logs. [PATCH 5/5] Thermal: Add ST-Ericsson db8500 thermal dirver. This patch is to add ST-Ericsson into the latest kervel version. hongbo.zhang (5): Thermal: do bind operation after thermal zone or cooling device register returns. Thermal: add indent for code alignment. Thermal: fix empty list checking method. Thermal: make sure cpufreq cooling register after cpufreq driver Thermal: Add ST-Ericsson db8500 thermal dirver. arch/arm/boot/dts/dbx5x0.dtsi | 11 + arch/arm/configs/u8500_defconfig | 4 + arch/arm/mach-ux500/board-mop500.c | 73 ++++ drivers/thermal/Kconfig | 20 ++ drivers/thermal/Makefile | 2 + drivers/thermal/cpu_cooling.c | 19 +- drivers/thermal/db8500_cpufreq_cooling.c | 118 +++++++ drivers/thermal/db8500_thermal.c | 507 +++++++++++++++++++++++++++ drivers/thermal/thermal_sys.c | 86 +++-- include/linux/platform_data/db8500_thermal.h | 39 +++ 10 files changed, 847 insertions(+), 32 deletions(-) create mode 100644 drivers/thermal/db8500_cpufreq_cooling.c create mode 100644 drivers/thermal/db8500_thermal.c create mode 100644 include/linux/platform_data/db8500_thermal.h -- 1.7.11.3 -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/