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From:   "Rafael J. Wysocki" <rafael@kernel.org>
Date:   Fri, 3 Mar 2023 20:48:16 +0100
Message-ID: <CAJZ5v0i9fbEpedS-CCM5qvfaG095jUDzOFd-H83G3mpwDaxoAA@mail.gmail.com>
Subject: Re: [PATCH v5 00/18] Self-encapsulate the thermal zone device structure
To:     Daniel Lezcano <daniel.lezcano@linaro.org>
Cc:     rafael@kernel.org, linux-pm@vger.kernel.org,
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Hi Daniel,

On Fri, Mar 3, 2023 at 10:24 AM Daniel Lezcano
<daniel.lezcano@linaro.org> wrote:
>
>
> Hi Rafael,
>
> Do we have enough ack to apply this series, is it for you ?

I've just queued it up for 6.4.

It will reach linux-next and the thermal branch some time next week,
but I will be traveling, so there may be delays.

Thanks!