Daniel Lezcano ([email protected])

Number of posts: 5720 (1.21 per day)
First post: 2011-06-16 10:49:10
Last post: 2024-06-13 12:11:50

Date	List	Subject
2023-04-27 07:47:24	linux-kernel	Re: [PATCH v1] thermal: intel: menlow: Get rid of this driver
2023-04-26 13:39:01	linux-kernel	Re: Missing signoff in the thermal tree
2023-04-26 11:22:00	linux-kernel	Re: [GIT PULL] timers material for v6.4-rc1
2023-04-26 09:38:42	linux-kernel	[GIT PULL] thermal for v6.4-rc1 #3
2023-04-25 11:47:07	linux-kernel	[GIT PULL] timers material for v6.4-rc1
2023-04-21 13:43:02	linux-kernel	Re: [PATCH] dt-bindings: thermal: qcom-tsens: correct unit address
2023-04-20 21:50:43	linux-kernel	Re: [PATCH v4 6/6] thermal/drivers/intel_menlow: Make additionnal sysfs information optional
2023-04-19 08:37:25	linux-kernel	[PATCH v4 6/6] thermal/drivers/intel_menlow: Make additionnal sysfs information optional
2023-04-19 08:36:01	linux-kernel	[PATCH v4 5/6] thermal/drivers/acpi: Move to dedicated function sysfs extra attr creation
2023-04-19 08:35:30	linux-kernel	[PATCH v4 2/6] thermal/drivers/intel_pch_thermal: Use thermal driver device to write a trace
2023-04-19 08:35:29	linux-kernel	[PATCH v4 4/6] thermal/drivers/menlow: Use thermal_zone_device()
2023-04-19 08:35:26	linux-kernel	[PATCH v4 0/6] Thermal zone device structure encapsulation
2023-04-19 08:35:12	linux-kernel	[PATCH v4 3/6] thermal/drivers/acpi: Use thermal_zone_device()
2023-04-19 08:34:51	linux-kernel	[PATCH v4 1/6] thermal/core: Encapsulate tz->device field
2023-04-19 07:53:54	linux-kernel	Re: [PATCH] thermal: mediatek: Use of_address_to_resource()
2023-04-19 07:53:23	linux-kernel	Re: [PATCH] clocksource: ti: Use of_property_read_bool() for boolean properties
2023-04-19 07:53:16	linux-kernel	Re: [PATCH 0/2] MediaTek AUXADC thermal: urgent fixes
2023-04-19 07:45:28	linux-kernel	Re: [PATCH v5 1/2] thermal: mediatek: use devm_of_iomap to avoid resource leak in mtk_thermal_probe
2023-04-18 13:58:48	linux-kernel	Re: [PATCH v3 5/6] thermal/drivers/acpi: Make cross dev link optional by configuration
2023-04-18 13:47:33	linux-kernel	Re: [PATCH v3 5/6] thermal/drivers/acpi: Make cross dev link optional by configuration
2023-04-18 13:43:12	linux-kernel	Re: [PATCH] thermal/drivers/cpuidle_cooling: Delete unmatched comments
2023-04-18 08:35:53	linux-kernel	[PATCH v1 2/3] thermal/core: Reorder the headers inclusion
2023-04-18 08:35:11	linux-kernel	[PATCH v1 1/3] thermal/core: Hardening the self-encapsulation
2023-04-18 08:35:08	linux-kernel	[PATCH v1 3/3] thermal/core: Move the thermal zone structure to the private core header
2023-04-18 08:34:58	linux-kernel	[PATCH v1 0/3] Move the thermal zone device structure in private header
2023-04-17 13:19:29	linux-kernel	Re: [PATCH v3 0/6] Thermal zone device structure encapsulation
2023-04-17 12:12:56	linux-kernel	Re: [PATCH v2] thermal/drivers/intel/int340x: Add DLVR support
2023-04-17 10:01:33	linux-kernel	Re: [PATCH v2] thermal/drivers/intel/int340x: Add DLVR support
2023-04-17 09:59:31	linux-kernel	Re: [PATCH v3 2/2] thermal: mediatek: change clk_prepare_enable to devm_clk_get_enabled in mtk_thermal_probe
2023-04-17 07:55:13	linux-kernel	Re: [PATCH v4 3/5] dt-bindings: thermal: Use generic ADC node name in examples
2023-04-17 07:45:48	linux-crypto	Re: [PATCH V2 3/6] dt-bindings: imx-thermal: add imx6sll and imx6ul compatible
2023-04-17 07:37:14	linux-kernel	Re: [PATCH] clocksource/drivers/timer-ti-dm: Fix finding alwon timer
2023-04-16 09:52:42	linux-kernel	[GIT PULL] thermal for v6.4-rc1 #2
2023-04-14 15:12:57	linux-kernel	Re: [PATCH V3] thermal/core/power_allocator: avoid thermal cdev can not be reset
2023-04-14 11:16:41	linux-kernel	Re: [PATCH V3] thermal/core/power_allocator: avoid thermal cdev can not be reset
2023-04-13 23:15:47	linux-kernel	[RFC PATCH] thermal/core: Update the generic trip points
2023-04-13 11:51:03	linux-kernel	[PATCH v3 6/6] thermal/drivers/intel_menlow: Make additionnal sysfs information optional
2023-04-13 11:50:08	linux-kernel	[PATCH v3 5/6] thermal/drivers/acpi: Make cross dev link optional by configuration
2023-04-13 11:49:51	linux-kernel	[PATCH v3 2/6] thermal/drivers/intel_pch_thermal: Use thermal driver device to write a trace
2023-04-13 11:49:28	linux-kernel	[PATCH v3 1/6] thermal/core: Encapsulate tz->device field
2023-04-13 11:49:19	linux-kernel	[PATCH v3 4/6] thermal/drivers/menlow: Use thermal_zone_device()
2023-04-13 11:49:07	linux-kernel	[PATCH v3 0/6] Thermal zone device structure encapsulation
2023-04-13 11:48:51	linux-kernel	[PATCH v3 3/6] thermal/drivers/acpi: Use thermal_zone_device()
2023-04-13 07:41:46	linux-kernel	Re: [PATCH V3] thermal/core/power_allocator: avoid thermal cdev can not be reset
2023-04-12 19:20:18	linux-kernel	Re: [PATCH v2 2/7] thermal/core: Encapsulate tz->device field
2023-04-11 20:26:32	linux-kernel	Re: [PATCH v2 6/7] thermal/drivers/acpi: Make cross dev link optional by configuration
2023-04-11 20:24:28	linux-kernel	Re: [PATCH v2 2/7] thermal/core: Encapsulate tz->device field
2023-04-11 20:14:21	linux-kernel	Re: [PATCH v2 1/7] thermal/drivers/intel_pch_thermal: Use thermal driver device to write a trace
2023-04-11 10:49:42	linux-kernel	Re: thermal/drivers/tegra: Getting rid of the get_thermal_instance() usage
2023-04-11 08:45:04	linux-kernel	Re: [PATCH] drivers: clocksource: fix memory leak in davinci_timer_register
2023-04-10 20:56:02	linux-kernel	[PATCH v2 4/7] thermal/drivers/menlow: Use thermal_zone_device()