| Date |
List |
Subject |
|
2020-02-06 19:27:57
|
linux-kernel
|
Re: [PATCH v8 0/7] add thermal sensor driver for A64, A83T, H3, H5, H6, R40 |
|
2020-02-06 19:24:54
|
linux-kernel
|
Re: [PATCH v8 0/7] add thermal sensor driver for A64, A83T, H3, H5, H6, R40 |
|
2020-02-06 14:16:10
|
linux-kernel
|
Re: [PATCH v8 0/7] add thermal sensor driver for A64, A83T, H3, H5, H6, R40 |
|
2020-01-15 06:00:31
|
linux-kernel
|
Re: [PATCH v3 2/6] thermal: brcmstb_thermal: Prepare to support a different process |
|
2020-01-15 05:59:23
|
linux-kernel
|
Re: [PATCH v3 1/6] thermal: brcmstb_thermal: Do not use DT coefficients |
|
2019-12-13 04:43:57
|
linux-kernel
|
Re: [RESEND PATCH] thermal: rockchip: enable hwmon |
|
2019-12-13 04:43:57
|
linux-kernel
|
Re: [RESEND PATCH] thermal: rockchip: enable hwmon |
|
2019-12-12 17:10:21
|
linux-kernel
|
Re: [PATCH v2 1/1] arm64: dts: qcom: sc7180: Add device node support for TSENS in SC7180 |
|
2019-12-12 16:58:02
|
linux-kernel
|
Re: [PATCH v2 1/1] arm64: dts: qcom: sc7180: Add device node support for TSENS in SC7180 |
|
2019-12-12 11:02:34
|
linux-kernel
|
Re: [PATCH v2 1/1] arm64: dts: qcom: sc7180: Add device node support for TSENS in SC7180 |
|
2019-12-12 08:31:05
|
linux-kernel
|
Re: [RESEND PATCH] thermal: rockchip: enable hwmon |
|
2019-12-10 06:52:11
|
linux-kernel
|
Re: [PATCH] drivers: thermal: step_wise: add support for hysteresis |
|
2019-12-09 07:51:28
|
linux-kernel
|
Re: [PATCH v3 3/3] thermal: create softlink by name for thermal_zone and cooling_device |
|
2019-12-09 07:51:25
|
linux-kernel
|
Re: [PATCH v3 2/3] thermal: improve error message in thermal zone registration |
|
2019-12-09 07:51:11
|
linux-kernel
|
Re: [PATCH v3 1/3] thermal: prevent cooling device with no type to be registered |
|
2019-12-05 07:06:57
|
linux-kernel
|
Re: [PATCH v2 1/2] thermal: fix and clean up tz and cdev registration |
|
2019-12-05 06:29:55
|
linux-kernel
|
Re: [PATCH v2 1/2] thermal: fix and clean up tz and cdev registration |
|
2019-12-05 04:15:32
|
linux-kernel
|
Re: [PATCH v2 2/2] thermal: create softlink by name for thermal_zone and cooling_device |
|
2019-12-05 04:14:27
|
linux-kernel
|
Re: [PATCH v2 1/2] thermal: fix and clean up tz and cdev registration |
|
2019-12-04 19:30:20
|
linux-kernel
|
Re: [PATCH 1/6] thermal: brcmstb_thermal: Do not use DT coefficients |
|
2019-12-04 12:47:06
|
linux-kernel
|
Re: [PATCH] thermal: create softlink by name for thermal_zone and cooling_device |
|
2019-12-04 09:41:09
|
linux-kernel
|
Re: [PATCH 6/6] thermal: brcmstb_thermal: Register different ops per process |
|
2019-12-04 09:39:14
|
linux-kernel
|
Re: [PATCH 5/6] thermal: brcmstb_thermal: Restructure interrupt registration |
|
2019-12-04 08:45:29
|
linux-kernel
|
Re: [PATCH 4/6] thermal: brcmstb_thermal: Add 16nm process thermal parameters |
|
2019-12-04 08:42:39
|
linux-kernel
|
Re: [PATCH 1/6] thermal: brcmstb_thermal: Do not use DT coefficients |
|
2019-12-03 17:12:42
|
linux-kernel
|
Re: [PATCH v3 3/7] thermal: core: Add late init hook to cooling device ops |
|
2019-12-03 17:06:05
|
linux-kernel
|
Re: [PATCH v3 3/7] thermal: core: Add late init hook to cooling device ops |
|
2019-12-03 16:59:17
|
linux-kernel
|
Re: [PATCH 1/4] dt-bindings: thermal: Introduce monitor-falling parameter to thermal trip point binding |
|
2019-11-25 09:58:51
|
linux-kernel
|
Re: [PATCH] MAINTAINERS: thermal: Eduardo's email is bouncing |
|
2019-11-19 10:57:05
|
linux-kernel
|
Re: [Patch v5 6/6] sched/fair: Enable tuning of decay period |
|
2019-11-19 10:56:04
|
linux-kernel
|
Re: [Patch v5 2/6] sched/fair: Add infrastructure to store and update instantaneous thermal pressure |
|
2019-11-19 10:56:03
|
linux-kernel
|
Re: [Patch v5 0/6] Introduce Thermal Pressure |
|
2019-11-19 10:54:55
|
linux-kernel
|
Re: [Patch v5 1/6] sched/pelt.c: Add support to track thermal pressure |
|
2019-11-19 10:54:17
|
linux-kernel
|
Re: [Patch v5 4/6] sched/fair: update cpu_capcity to reflect thermal pressure |
|
2019-11-11 05:28:08
|
linux-kernel
|
Re: [PATCH] thermal: create softlink by name for thermal_zone and cooling_device |
|
2019-11-04 06:24:24
|
linux-kernel
|
Re: [PATCH 2/2] thermal: cpu_cooling: Reorder the header file |
|
2019-10-31 04:45:21
|
linux-kernel
|
Re: [PATCH v5 0/6] Initialise thermal framework and cpufreq earlier during boot |
|
2019-10-18 15:45:17
|
linux-kernel
|
Re: [PATCH v2 0/5] Initialise thermal framework and cpufreq earlier during boot |
|
2019-10-17 12:49:12
|
linux-kernel
|
Re: [PATCH] thermal: create softlink by name for thermal_zone and cooling_device |
|
2019-10-17 12:36:14
|
linux-kernel
|
Re: [PATCH] thermal: create softlink by name for thermal_zone and cooling_device |
|
2019-10-16 12:25:22
|
linux-kernel
|
Re: [PATCH] arm64: defconfig: Enable Qualcomm CPUfreq HW driver |
|
2019-10-04 08:08:20
|
linux-kernel
|
Re: [PATCH] arm64: dts: qcom: msm8998-clamshell: Remove retention idle state |
|
2019-09-26 10:54:57
|
linux-kernel
|
Re: [PATCH] thermal: st: Use devm_platform_ioremap_resource() in st_mmap_regmap_init() |
|
2019-09-13 11:29:26
|
linux-kernel
|
Re: [PATCH v4 1/6] dt-bindings: thermal: Add DT bindings documentation for Amlogic Thermal |
|
2019-08-21 19:08:48
|
linux-kernel
|
Re: [PATCH v4 1/8] arm64: dts: qcom: sm8150: Add base dts file |
|
2019-08-21 09:41:27
|
linux-kernel
|
Re: [PATCH v3 8/8] arm64: dts: qcom: sm8150: Add apps shared nodes |
|
2019-08-21 08:30:35
|
linux-kernel
|
Re: [PATCH v3 5/8] arm64: dts: qcom: sm8150-mtp: add base dts file |
|
2019-08-20 13:36:27
|
linux-kernel
|
Re: [PATCH v2 1/8] arm64: dts: qcom: sm8150: add base dts file |
|
2019-07-30 18:06:04
|
linux-kernel
|
Re: [PATCH 3/3] arm64: dts: qcom: qcs404: remove unit name for thermal trip points |
|
2019-07-30 16:57:31
|
linux-kernel
|
Re: [PATCH 2/3] arm64: dts: qcom: pms405: remove reduandant properties |
|
2019-07-30 16:52:45
|
linux-kernel
|
Re: [PATCH 1/3] arm64: dts: qcom: pms405: add unit name adc nodes |