This patch adds the cooling device APIs to the
new thermal framework. The register/unregister
APIs stay the same. Below are some minimal
changes:
* Use DEVICE_ATTR_RO/RW macros
* Add 'struct idr idr' to struct thermal_cooling_device
* Tidy up the error handling paths in register API
* Use thermal_cdev_register as API name, to keep
THERMAL_V2 APIs along with the existing ones.
* Use 'cdevX' as name for cooling_device so as
to not collide with the existing ABI.
Signed-off-by: Durgadoss R <[email protected]>
---
drivers/thermal/thermal_core_new.c | 184 ++++++++++++++++++++++++++++++++++++
include/linux/thermal.h | 12 +++
2 files changed, 196 insertions(+)
diff --git a/drivers/thermal/thermal_core_new.c b/drivers/thermal/thermal_core_new.c
index b369a6f..463165c 100644
--- a/drivers/thermal/thermal_core_new.c
+++ b/drivers/thermal/thermal_core_new.c
@@ -39,15 +39,21 @@ MODULE_DESCRIPTION("Generic thermal management sysfs support v2");
MODULE_LICENSE("GPL v2");
static DEFINE_IDR(thermal_sensor_idr);
+static DEFINE_IDR(thermal_cdev_idr);
static LIST_HEAD(thermal_sensor_list);
+static LIST_HEAD(thermal_cdev_list);
static DEFINE_MUTEX(thermal_idr_lock);
static DEFINE_MUTEX(sensor_list_lock);
+static DEFINE_MUTEX(cdev_list_lock);
#define to_thermal_sensor(_dev) \
container_of(_dev, struct thermal_sensor, device)
+#define to_cooling_device(_dev) \
+ container_of(_dev, struct thermal_cooling_device, device)
+
static int get_idr(struct idr *idr, int *id)
{
int ret;
@@ -168,10 +174,69 @@ threshold_store(struct device *dev, struct device_attribute *attr,
return ret ? ret : count;
}
+static ssize_t
+type_show(struct device *dev, struct device_attribute *attr, char *buf)
+{
+ struct thermal_cooling_device *cdev = to_cooling_device(dev);
+
+ return sprintf(buf, "%s\n", cdev->type);
+}
+
+static ssize_t
+max_state_show(struct device *dev, struct device_attribute *attr, char *buf)
+{
+ struct thermal_cooling_device *cdev = to_cooling_device(dev);
+ unsigned long state;
+ int ret;
+
+ ret = cdev->ops->get_max_state(cdev, &state);
+ if (ret)
+ return ret;
+ return sprintf(buf, "%ld\n", state);
+}
+
+static ssize_t
+cur_state_show(struct device *dev, struct device_attribute *attr, char *buf)
+{
+ struct thermal_cooling_device *cdev = to_cooling_device(dev);
+ unsigned long state;
+ int ret;
+
+ ret = cdev->ops->get_cur_state(cdev, &state);
+ if (ret)
+ return ret;
+ return sprintf(buf, "%ld\n", state);
+}
+
+static ssize_t
+cur_state_store(struct device *dev, struct device_attribute *attr,
+ const char *buf, size_t count)
+{
+ struct thermal_cooling_device *cdev = to_cooling_device(dev);
+ unsigned long state;
+ int ret;
+
+ ret = sscanf(buf, "%ld\n", &state);
+ if (!ret)
+ return -EINVAL;
+
+ if ((long)state < 0)
+ return -EINVAL;
+
+ ret = cdev->ops->set_cur_state(cdev, state);
+
+ return ret ? ret : count;
+}
+
/* Thermal sensor attributes */
static DEVICE_ATTR_RO(name);
static DEVICE_ATTR_RO(temp);
+/* Thermal cooling device attributes */
+static DEVICE_ATTR_RO(type);
+static DEVICE_ATTR_RO(max_state);
+static DEVICE_ATTR_RW(cur_state);
+
/**
* thermal_create_sensor_sysfs - create sysfs nodes for sensorX
* @ts: the thermal sensor
@@ -365,3 +430,122 @@ void thermal_sensor_unregister(struct thermal_sensor *ts)
return;
}
EXPORT_SYMBOL_GPL(thermal_sensor_unregister);
+
+/**
+ * thermal_cdev_register() - register a new thermal cooling device
+ * @type: the thermal cooling device type.
+ * @devdata: device private data.
+ * @ops: standard thermal cooling devices callbacks.
+ *
+ * This interface function adds a new thermal cooling device to
+ * /sys/class/thermal/ folder as cooling_device[0-*].
+ *
+ * Return: a pointer to the created struct thermal_cooling_device or an
+ * ERR_PTR. Caller must check return value with IS_ERR*() helpers.
+ */
+struct thermal_cooling_device *thermal_cdev_register(char *type, void *devdata,
+ const struct thermal_cooling_device_ops *ops)
+{
+ struct thermal_cooling_device *cdev;
+ int result;
+
+ if (!type || (type && strlen(type) >= THERMAL_NAME_LENGTH))
+ return ERR_PTR(-EINVAL);
+
+ if (!ops || !ops->get_max_state || !ops->get_cur_state ||
+ !ops->set_cur_state)
+ return ERR_PTR(-EINVAL);
+
+ cdev = kzalloc(sizeof(*cdev), GFP_KERNEL);
+ if (!cdev)
+ return ERR_PTR(-ENOMEM);
+
+ idr_init(&cdev->idr);
+ result = get_idr(&thermal_cdev_idr, &cdev->id);
+ if (result)
+ goto exit_free;
+
+ strlcpy(cdev->type, type ? : "", sizeof(cdev->type));
+ mutex_init(&cdev->lock);
+ cdev->ops = ops;
+ cdev->updated = true;
+ cdev->device.class = &thermal_class;
+ cdev->devdata = devdata;
+
+ dev_set_name(&cdev->device, "cdev%d", cdev->id);
+ result = device_register(&cdev->device);
+ if (result)
+ goto exit_idr;
+
+ result = device_create_file(&cdev->device, &dev_attr_type);
+ if (result)
+ goto exit_unregister;
+
+ result = device_create_file(&cdev->device, &dev_attr_max_state);
+ if (result)
+ goto exit_type;
+
+ result = device_create_file(&cdev->device, &dev_attr_cur_state);
+ if (result) {
+ device_remove_file(&cdev->device, &dev_attr_max_state);
+ goto exit_type;
+ }
+
+ /* Add 'this' new cdev to the global cdev list */
+ mutex_lock(&cdev_list_lock);
+ list_add(&cdev->node, &thermal_cdev_list);
+ mutex_unlock(&cdev_list_lock);
+
+ return cdev;
+
+exit_type:
+ device_remove_file(&cdev->device, &dev_attr_type);
+exit_unregister:
+ device_unregister(&cdev->device);
+exit_idr:
+ release_idr(&thermal_cdev_idr, cdev->id);
+ idr_destroy(&cdev->idr);
+exit_free:
+ kfree(cdev);
+ return ERR_PTR(result);
+}
+EXPORT_SYMBOL_GPL(thermal_cdev_register);
+
+/**
+ * thermal_cdev_unregister - removes the registered thermal cooling device
+ * @cdev: the thermal cooling device to remove.
+ *
+ * thermal_cdev_unregister() must be called when the device is no
+ * longer needed.
+ */
+void thermal_cdev_unregister(struct thermal_cooling_device *cdev)
+{
+ struct thermal_cooling_device *pos, *next;
+ bool found = false;
+
+ if (!cdev)
+ return;
+
+ mutex_lock(&cdev_list_lock);
+ list_for_each_entry_safe(pos, next, &thermal_cdev_list, node) {
+ if (pos == cdev) {
+ list_del(&cdev->node);
+ found = true;
+ break;
+ }
+ }
+ mutex_unlock(&cdev_list_lock);
+ if (!found)
+ return;
+
+ device_remove_file(&cdev->device, &dev_attr_type);
+ device_remove_file(&cdev->device, &dev_attr_max_state);
+ device_remove_file(&cdev->device, &dev_attr_cur_state);
+
+ release_idr(&thermal_cdev_idr, cdev->id);
+ idr_destroy(&cdev->idr);
+ device_unregister(&cdev->device);
+ kfree(cdev);
+ return;
+}
+EXPORT_SYMBOL_GPL(thermal_cdev_unregister);
diff --git a/include/linux/thermal.h b/include/linux/thermal.h
index bb6b183..46d7dc3 100644
--- a/include/linux/thermal.h
+++ b/include/linux/thermal.h
@@ -158,6 +158,7 @@ struct thermal_cooling_device {
void *devdata;
const struct thermal_cooling_device_ops *ops;
bool updated; /* true if the cooling device does not need update */
+ struct idr idr;
struct mutex lock; /* protect thermal_instances list */
struct list_head thermal_instances;
struct list_head node;
@@ -334,6 +335,9 @@ static inline int thermal_generate_netlink_event(struct thermal_zone_device *tz,
struct thermal_sensor *thermal_sensor_register(const char *, int,
struct thermal_sensor_ops *, void *);
void thermal_sensor_unregister(struct thermal_sensor *);
+struct thermal_cooling_device *thermal_cdev_register(char *, void *,
+ const struct thermal_cooling_device_ops *);
+void thermal_cdev_unregister(struct thermal_cooling_device *);
#else
static inline struct thermal_sensor *thermal_sensor_register(const char *name,
int count, struct thermal_sensor_ops *ops, void *devdata)
@@ -341,5 +345,13 @@ static inline struct thermal_sensor *thermal_sensor_register(const char *name,
return ERR_PTR(-ENODEV);
}
static inline void thermal_sensor_unregister(struct thermal_sensor *ts) {}
+static inline struct thermal_cooling_device *thermal_cdev_register(
+ char *type, void *devdata,
+ const struct thermal_cooling_device_ops *ops)
+{
+ return ERR_PTR(-ENODEV);
+}
+static
+inline void thermal_cdev_unregister(struct thermal_cooling_device *cdev) {}
#endif
#endif /* __THERMAL_H__ */
--
1.7.9.5
This patch adds Documentation for the new APIs
introduced in this patch set. The documentation
also has a model sysfs structure for reference.
Signed-off-by: Durgadoss R <[email protected]>
---
Documentation/thermal/sysfs-api2.txt | 240 ++++++++++++++++++++++++++++++++++
1 file changed, 240 insertions(+)
create mode 100644 Documentation/thermal/sysfs-api2.txt
diff --git a/Documentation/thermal/sysfs-api2.txt b/Documentation/thermal/sysfs-api2.txt
new file mode 100644
index 0000000..1045dfc
--- /dev/null
+++ b/Documentation/thermal/sysfs-api2.txt
@@ -0,0 +1,240 @@
+Thermal Framework
+-----------------
+
+Written by Durgadoss R <[email protected]>
+Copyright (c) 2014 Intel Corporation
+
+Created on: 15 January 2014
+
+0. Introduction
+---------------
+The Linux thermal framework provides a set of interfaces for thermal
+sensors and thermal cooling devices (fan, processor...) to register
+with the thermal management solution and to be a part of it.
+
+This document focuses on how to enable new thermal sensors and cooling
+devices to participate in thermal management. This solution is intended
+to be 'light-weight' and platform/architecture independent. Any thermal
+sensor/cooling device should be able to use the infrastructure easily.
+
+The goal of thermal framework is to expose the thermal sensor/zone and
+cooling device attributes in a consistent way. This will help the
+thermal governors to make use of the information to manage platform
+thermals efficiently.
+
+The thermal sensor source file can be generic (can be any sensor driver,
+in any subsystem). This driver will use the sensor APIs and register with
+thermal framework to participate in platform Thermal management. This
+does not (and should not) know about which zone it belongs to, or any
+other information about platform thermals. A sensor driver is a standalone
+piece of code, which can optionally register with thermal framework.
+
+However, for any platform, there should be a platformX_thermal.c file,
+which will know about the platform thermal characteristics (e.g how many
+sensors, zones, cooling devices, etc.. And how they are related to each other
+i.e the mapping information). Only in this file, the zone level APIs should
+be used, in which case the file will have all information required to attach
+various sensors to a particular zone.
+
+This way, we can have one platform level thermal file, which can support
+multiple platforms (may be)using the same set of sensors (but)binded in
+a different way. This file can get the platform thermal information
+through Firmware, ACPI tables, device tree etc.
+
+Unfortunately, today we don't have many drivers that can be clearly
+differentiated as 'sensor_file.c' and 'platform_thermal_file.c'.
+But very soon we will need/have. We see a lot of chip drivers,
+starting to use thermal framework; we should keep it really
+light-weight for them to do so but at the same time provide all
+the necessary features to participate in platform thermal management.
+
+An Example: drivers/hwmon/emc1403.c - a generic thermal chip driver
+In one platform this sensor can belong to 'ZoneA' and in another the
+same can belong to 'ZoneB'. But, emc1403.c does not really care about
+where does it belong. It just reports temperature.
+
+1. Terminology
+--------------
+This section describes the terminology used in the rest of this
+document as well as the thermal framework code.
+
+thermal_sensor: Hardware that can report temperature of a particular
+ spot in the platform, where it is placed. The temperature
+ reported by the sensor is the 'real' temperature reported
+ by the hardware.
+thermal_zone: A virtual area on the device, that gets heated up. It may
+ have one or more thermal sensors attached to it.
+cooling_device: Any component that can help in reducing the temperature of
+ a 'hot spot' either by reducing its performance (passive
+ cooling) or by other means(Active cooling E.g. Fan)
+
+trip_points: Various temperature levels for each sensor. As of now, we
+ have four levels namely active, passive, hot and critical.
+ Hot and critical trip point support only one value whereas
+ active and passive can have any number of values. These
+ temperature values can come from platform data, and are
+ exposed through sysfs in a consistent manner. Stand-alone
+ thermal sensor drivers are not expected to know these values.
+ These values are RO.
+thresholds: These are programmable temperature limits, on reaching which
+ the thermal sensor generates an interrupt. The framework is
+ notified about this interrupt to take appropriate action.
+ There can be as many number of thresholds as that of the
+ hardware supports. These values are RW.
+
+thermal_map: This provides the mapping (aka binding) information between
+ various sensors and cooling devices in a particular zone.
+ Typically, this also comes from platform data; Stand-alone
+ sensor drivers or cooling device drivers are not expected
+ to know these mapping information.
+
+2. Thermal framework APIs
+-------------------------
+2.1: For Thermal Sensors
+2.1.1 thermal_sensor_register:
+ This function creates a new sensor directory under /sys/class/thermal/
+ as sensor[0-*]. This API is expected to be called by thermal sensor
+ drivers. These drivers may or may not be in thermal subsystem. This
+ function returns a thermal_sensor structure on success and appropriate
+ error on failure.
+
+ name: Name of the sensor
+ count: Number of programmable thresholds associated with this sensor
+ devdata: Device private data
+ ops: Thermal sensor callbacks
+ .get_temp: obtain the current temperature of the sensor
+ .get_trend: obtain the trend of the sensor
+ .get_threshold: get a particular threshold temperature
+ .set_threshold: set a particular threshold temperature
+ .get_hyst: get hysteresis value associated with a threshold
+ .set_hyst: set hysteresis value associated with a threshold
+
+2.1.2 thermal_sensor_unregister:
+ This function deletes the sensor directory under /sys/class/thermal/
+ for the given sensor. Thermal sensor drivers may call this API
+ during the driver's 'exit' routine.
+
+ ts: Thermal sensor that has to be unregistered
+
+2.2: For Cooling Devices
+2.2.1 thermal_cdev_register:
+ This function adds a new thermal cooling device (fan/processor/...)
+ to /sys/class/thermal/ folder as cdev[0-*]. This function
+ is expected to be called by cooling device drivers that may be
+ present in other subsystems also.
+
+ name: the cooling device name
+ devdata: device private data
+ ops: thermal cooling devices callbacks
+ .get_max_state: get the Maximum throttle state of the cooling device
+ .get_cur_state: get the Current throttle state of the cooling device
+ .set_cur_state: set the Current throttle state of the cooling device
+
+2.2.2 thermal_cdev_unregister:
+ This function deletes the given cdev entry form /sys/class/thermal;
+ and also cleans all the symlinks referred from various zones.
+
+ cdev: Cooling device to be unregistered
+
+2.3: For Thermal Zones
+2.3.1 thermal_create_thermal_zone:
+ This function adds a new 'zone' under /sys/class/thermal/
+ directory as zone[0-*]. This zone has at least one thermal
+ sensor and at most MAX_SENSORS_PER_ZONE number of sensors
+ attached to it. Similarly, this zone has at least one cdev
+ and at most MAX_CDEVS_PER_ZONE number of cdevs attached to it.
+ As of now, MAX_*_PER_ZONE values are hard-coded to 5. We can
+ make them configurable, through Kconfig option(during 'menuconfig').
+
+ name: Name of the thermal zone
+ devdata: Device private data
+
+2.3.2 thermal_add_sensor_to_zone
+ This function adds a 'sensorX' entry under /sys/class/thermal/
+ zoneY/ directory. This 'sensorX' is a symlink to the actual
+ sensor entry under /sys/class/thermal/. Correspondingly, the
+ method remove_sensor_from_zone deletes the symlink.
+
+ tz: thermal zone structure
+ ts: thermal sensor structure
+
+2.3.3 thermal_add_cdev_to_zone
+ This function adds a 'cdevX' entry under /sys/class/thermal/
+ zoneY/ directory. This 'cdevX' is a symlink to the actual
+ cdev entry under /sys/class/thermal/. Correspondingly, the
+ method remove_cdev_from_zone deletes the symlink.
+
+ tz: thermal zone structure
+ cdev: thermal cooling device structure
+
+2.4 For Thermal Trip
+2.4.1 thermal_add_sensor_trip_info
+ This function adds trip point information for the given sensor,
+ (under a given zone) under /sys/class/thermal/zoneX/.
+ This API creates sysfs attributes namely:
+ sensorX_trip_activeY, sensorX_trip_passiveY, sensorX_trip_hot,
+ sensorX_trip_critical. Each of these hold one trip point temperature
+ (in mC) values, as provided from platform data. As of now, we
+ support many Active and Passive trip points but only one hot
+ one critical trip point.
+
+ tz: thermal zone structure
+ ts: thermal sensor to which the trip points are attached
+ trip: trip point structure. Usually obtained from platform data
+
+2.5 For Thermal Map
+2.5.1 thermal_add_map_entry
+ This function adds a 'map[0-*]' sysfs attribute under
+ /sys/class/thermal/zoneX/mapY_*. Each map attribute helps
+ to describe the binding relationship between a sensor and
+ a cdev in the given zone. The map structure is typically
+ obtained as platform data. For example, through ACPI tables,
+ SFI tables, Device tree etc. The trip mask is a hex value;
+ if 'n' th bit (from LSB) is set, then for trip point 'n' this
+ cdev is throttled with the given weight[n].
+
+ tz: thermal zone to which a 'map' is being added
+ map: thermal_map structure
+
+3. Sysfs attributes structure
+-----------------------------
+Thermal sysfs attributes will be represented under /sys/class/thermal.
+
+3.1: For Thermal Sensors
+ /sys/class/thermal/sensor[0-*]:
+ |---type: Name of the thermal sensor
+ |---temp_input: Current temperature in mC
+ |---threshold[0-*]: Threshold temperature in mC
+ |---threshold[0-*]_hyst:Optional hysteresis value in mC
+
+3.2: For Thermal Cooling Devices
+ /sys/class/thermal/cdev[0-*]:
+ |---type: Type of the cooling device
+ |---max_state: Maximum throttle state of the cdev
+ |---cur_state: Current throttle state of the cdev
+
+3.3: For Thermal Zones
+ /sys/class/thermal/zone[0-*]:
+ |---zone_name: Name of the thermal zone
+ |---sensorX: Symlink to ../sensorX
+ |---cdevY: Symlink to ../cdevY
+ |---sensorX_trip_activeM: Active trip point for sensorX
+ |---sensorX_trip_passiveN: Passive trip point for sensorX
+ |---sensorX_trip_hot: Hot trip point for sensorX
+ |---sensorX_trip_critical: Critical trip point for sensorX
+ |---mapX_sensor_name: Sensor Name
+ |---mapX_cdev_name: Cooling device Name
+ |---mapX_trip_type: Trip point type
+ |---mapX_trip_mask: Trip point mask
+ |---mapX_weightY: Weights (used by governors)
+
+3.5: For Thermal Map
+ Each attribute represents the mapping/binding information between
+ a sensor and a cdev, together with a trip type.
+ /sys/class/thermal/zoneX/:
+ |---mapY_trip_type: active/passive
+ |---mapY_sensor_name: cpu
+ |---mapY_cdev_name: proc
+ |---mapY_trip_mask: 0x03
+ |---mapY_weight0: 50
+ |---mapY_weight1: 30
--
1.7.9.5
This patch adds Documentation for ABI's introduced
for thermal subsystem (under /sys/class/thermal/).
Signed-off-by: Durgadoss R <[email protected]>
---
Documentation/ABI/testing/sysfs-class-thermal | 161 +++++++++++++++++++++++++
1 file changed, 161 insertions(+)
create mode 100644 Documentation/ABI/testing/sysfs-class-thermal
diff --git a/Documentation/ABI/testing/sysfs-class-thermal b/Documentation/ABI/testing/sysfs-class-thermal
new file mode 100644
index 0000000..144efc1
--- /dev/null
+++ b/Documentation/ABI/testing/sysfs-class-thermal
@@ -0,0 +1,161 @@
+What: /sys/class/thermal/sensorX/temp
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Exposes 'temperature' of a thermal sensor in mC
+Users: Kernel/User space thermal governors
+
+What: /sys/class/thermal/sensorX/name
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Name of the thermal sensor
+Users: Kernel/User space thermal governors
+
+What: /sys/class/thermal/sensorX/thresholdY
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Programmable threshold (in terms of mC). On reaching
+ this, the thermal governors may take action to control
+ temperature.
+Users: Kernel/User space thermal governors
+
+What: /sys/class/thermal/cdevX/type
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Type of the cooling device
+Users: Kernel/User space thermal governors
+
+What: /sys/class/thermal/cdevX/cur_state
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Current throttle state the cooling device is in
+Users: Kernel/User space thermal governors
+
+What: /sys/class/thermal/cdevX/max_state
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Maximum number of throttle states the cooling device supports
+Users: Kernel/User space thermal governors
+
+What: /sys/class/thermal/zoneX/zone_name
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Name of the thermal zone.
+Users: Kernel/User space thermal governors
+
+What: /sys/class/thermal/zoneX/sensorY
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Symlink to a sensor associated with this zone.
+Users: User space thermal governors or applications
+
+What: /sys/class/thermal/zoneX/cooling_deviceY
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Symlink to a cooling device associated with this zone.
+Users: User space thermal governors or applications
+
+What: /sys/class/thermal/zoneX/sensorY_trip_activeM
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Active Trip point temperature in mC for sensorY in
+ thermal zoneX.
+Users: Kernel/User space thermal governors
+
+What: /sys/class/thermal/zoneX/sensorY_trip_passiveN
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Passive Trip point temperature in mC for sensorY in
+ thermal zoneX.
+Users: Kernel/User space thermal governors
+
+What: /sys/class/thermal/zoneX/sensorY_trip_hot
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Hot trip point for 'sensorY' in 'zoneX' (in mC).
+Users: Kernel/User space thermal governors
+
+What: /sys/class/thermal/zoneX/sensorY_trip_critical
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Critical trip point for 'sensorY' in 'zoneX' (in mC).
+Users: Kernel/User space thermal governors
+
+What: /sys/class/thermal/zoneX/mapY_trip_type
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Mapping information between a sensor and a cooling device
+ in 'zoneX'. This interface provides the trip_type for a
+ particular map(Y).
+Users: Kernel/User space thermal governors
+
+What: /sys/class/thermal/zoneX/mapY_sensor_name
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Mapping information between a sensor and a cooling device
+ in 'zoneX'. This interface provides the name of the sensor
+ used in this map(Y).
+Users: Kernel/User space thermal governors
+
+What: /sys/class/thermal/zoneX/mapY_cdev_name
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Mapping information between a sensor and a cooling device
+ in 'zoneX'. This interface provides the name of the cooling
+ device used in this map(Y).
+Users: Kernel/User space thermal governors
+
+What: /sys/class/thermal/zoneX/mapY_trip_mask
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Mapping information between a sensor and a cooling device
+ in 'zoneX'. This interface provides the trip point mask,
+ which defines whether or not to throttle a particular
+ cooling device. See Documentation/thermal/sysfs-api2.txt
+ for more information on this interface.
+Users: Kernel/User space thermal governors
+
+What: /sys/class/thermal/zoneX/mapY_weightN
+Date: January 2014
+KernelVersion: 3.13
+Contact: Linux PM Mailing list <[email protected]>
+Description:
+ Mapping information between a sensor and a cooling device
+ in 'zoneX'. This interface provides the weights that can
+ be used to throttle a cooling device, on thermal violations.
+ See Documentation/thermal/sysfs-api2.txt for more details on
+ this interface.
+Users: Kernel/User space thermal governors
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1.7.9.5