From: Zhang Rui <[email protected]>
RAPL "package" domains are actually implemented in hardware per-die.
Thus, the new multi-die/package systems have mulitple domains
within each physical package.
Update the intel_rapl driver to be "die aware" -- exporting multiple
domains within a single package, when present.
No change on single die/package systems.
Signed-off-by: Zhang Rui <[email protected]>
Signed-off-by: Len Brown <[email protected]>
Acked-by: Rafael J. Wysocki <[email protected]>
Cc: [email protected]
---
drivers/powercap/intel_rapl.c | 4 ++--
1 file changed, 2 insertions(+), 2 deletions(-)
diff --git a/drivers/powercap/intel_rapl.c b/drivers/powercap/intel_rapl.c
index 3c3c0c23180b..9202dbcef96d 100644
--- a/drivers/powercap/intel_rapl.c
+++ b/drivers/powercap/intel_rapl.c
@@ -266,7 +266,7 @@ static struct rapl_domain *platform_rapl_domain; /* Platform (PSys) domain */
/* caller to ensure CPU hotplug lock is held */
static struct rapl_package *rapl_find_package_domain(int cpu)
{
- int id = topology_physical_package_id(cpu);
+ int id = topology_logical_die_id(cpu);
struct rapl_package *rp;
list_for_each_entry(rp, &rapl_packages, plist) {
@@ -1459,7 +1459,7 @@ static void rapl_remove_package(struct rapl_package *rp)
/* called from CPU hotplug notifier, hotplug lock held */
static struct rapl_package *rapl_add_package(int cpu)
{
- int id = topology_physical_package_id(cpu);
+ int id = topology_logical_die_id(cpu);
struct rapl_package *rp;
int ret;
--
2.18.0-rc0