2014-06-03 10:01:00

by Punit Agrawal

Subject: [PATCH] thermal: Bind cooling devices with the correct arguments

When binding cooling devices to thermal zones created from the device
tree the minimum and maximum cooling states are in the wrong order
leading to failure to bind.

Fix the order of cooling states in the call to
thermal_zone_bind_cooling_device to fix this.

Cc:Zhang Rui <[email protected]>
Signed-off-by: Punit Agrawal <[email protected]>
---
Hi Eduardo,

I am hoping this can be picked up for 3.16 as a bug fix.

Thanks,
Punit

drivers/thermal/of-thermal.c | 4 ++--
1 file changed, 2 insertions(+), 2 deletions(-)

diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c
index 04b1be7..97d312f 100644
--- a/drivers/thermal/of-thermal.c
+++ b/drivers/thermal/of-thermal.c
@@ -156,8 +156,8 @@ static int of_thermal_bind(struct thermal_zone_device *thermal,

ret = thermal_zone_bind_cooling_device(thermal,
tbp->trip_id, cdev,
- tbp->min,
- tbp->max);
+ tbp->max,
+ tbp->min);
if (ret)
return ret;
}
--
1.7.10.4

2014-06-17 10:20:48

by Punit Agrawal

Subject: Re: [PATCH] thermal: Bind cooling devices with the correct arguments

Ping?

Punit Agrawal <[email protected]> writes:

> When binding cooling devices to thermal zones created from the device
> tree the minimum and maximum cooling states are in the wrong order
> leading to failure to bind.
>
> Fix the order of cooling states in the call to
> thermal_zone_bind_cooling_device to fix this.
>
> Cc:Zhang Rui <[email protected]>
> Signed-off-by: Punit Agrawal <[email protected]>
> ---
> Hi Eduardo,
>
> I am hoping this can be picked up for 3.16 as a bug fix.
>
> Thanks,
> Punit
>
> drivers/thermal/of-thermal.c | 4 ++--
> 1 file changed, 2 insertions(+), 2 deletions(-)
>
> diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c
> index 04b1be7..97d312f 100644
> --- a/drivers/thermal/of-thermal.c
> +++ b/drivers/thermal/of-thermal.c
> @@ -156,8 +156,8 @@ static int of_thermal_bind(struct thermal_zone_device *thermal,
>
> ret = thermal_zone_bind_cooling_device(thermal,
> tbp->trip_id, cdev,
> - tbp->min,
> - tbp->max);
> + tbp->max,
> + tbp->min);
> if (ret)
> return ret;
> }

2014-06-18 22:17:52

by Stephen Boyd

Subject: Re: [PATCH] thermal: Bind cooling devices with the correct arguments

On 06/17/14 03:20, Punit Agrawal wrote:
> Ping?
>
> Punit Agrawal <[email protected]> writes:
>
>> When binding cooling devices to thermal zones created from the device
>> tree the minimum and maximum cooling states are in the wrong order
>> leading to failure to bind.
>>
>> Fix the order of cooling states in the call to
>> thermal_zone_bind_cooling_device to fix this.
>>
>> Cc:Zhang Rui <[email protected]>
>> Signed-off-by: Punit Agrawal <[email protected]>

Ah I ran into the same problem while testing out some thermal DT stuff.

Reviewed-by: Stephen Boyd <[email protected]>

--
Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum,
hosted by The Linux Foundation

2014-06-24 10:43:46

by Punit Agrawal

Subject: Re: [PATCH] thermal: Bind cooling devices with the correct arguments

Stephen Boyd <[email protected]> writes:

> On 06/17/14 03:20, Punit Agrawal wrote:
>> Ping?
>>
>> Punit Agrawal <[email protected]> writes:
>>
>>> When binding cooling devices to thermal zones created from the device
>>> tree the minimum and maximum cooling states are in the wrong order
>>> leading to failure to bind.
>>>
>>> Fix the order of cooling states in the call to
>>> thermal_zone_bind_cooling_device to fix this.
>>>
>>> Cc:Zhang Rui <[email protected]>
>>> Signed-off-by: Punit Agrawal <[email protected]>
>
> Ah I ran into the same problem while testing out some thermal DT stuff.
>
> Reviewed-by: Stephen Boyd <[email protected]>

Thanks Stephen!

Rui, can you pick this patch?

2014-07-02 11:54:17

by Eduardo Valentin

Subject: Re: [PATCH] thermal: Bind cooling devices with the correct arguments

Punit,

On Tue, Jun 3, 2014 at 5:59 AM, Punit Agrawal <[email protected]> wrote:
> When binding cooling devices to thermal zones created from the device
> tree the minimum and maximum cooling states are in the wrong order
> leading to failure to bind.
>
> Fix the order of cooling states in the call to
> thermal_zone_bind_cooling_device to fix this.
>
> Cc:Zhang Rui <[email protected]>

Acked-by: Eduardo Valentin <[email protected]>

Rui, to avoid further delays, can you please pick this one directly?

> Signed-off-by: Punit Agrawal <[email protected]>
> ---
> Hi Eduardo,
>
> I am hoping this can be picked up for 3.16 as a bug fix.
>
> Thanks,
> Punit
>
> drivers/thermal/of-thermal.c | 4 ++--
> 1 file changed, 2 insertions(+), 2 deletions(-)
>
> diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c
> index 04b1be7..97d312f 100644
> --- a/drivers/thermal/of-thermal.c
> +++ b/drivers/thermal/of-thermal.c
> @@ -156,8 +156,8 @@ static int of_thermal_bind(struct thermal_zone_device *thermal,
>
> ret = thermal_zone_bind_cooling_device(thermal,
> tbp->trip_id, cdev,
> - tbp->min,
> - tbp->max);
> + tbp->max,
> + tbp->min);
> if (ret)
> return ret;
> }
> --
> 1.7.10.4
>



--
Eduardo Bezerra Valentin