Hi Rafael,
can you consider pulling these changes ? They have been in linux-next
since several days and they fix some minor issues, except one of them
which is an urgent one for Mediatek.
The following changes since commit 5bc6b1df65c87f8dd7d0afe494a2c0b9d5c73140:
thermal: intel: int340x: Add DLVR support for RFIM control
(2023-04-18 15:24:40 +0200)
are available in the Git repository at:
ssh://[email protected]/pub/scm/linux/kernel/git/thermal/linux.git
tags/thermal-v6.4-rc1-3
for you to fetch changes up to 2afa82d1fc648c8d4c2ef9e876626abb1089f9ab:
dt-bindings: thermal: qcom-tsens: Correct unit address (2023-04-26
10:38:35 +0200)
----------------------------------------------------------------
- Add compatible strings DT bindings for imx6sll and imx6ul to fix
dtbs check warning (Stefan Wahren)
- Update the example in the DT bindings to reflect changes with the
ADC node name for QCom TM and TM5 (Marijn Suijten)
- Fix the comments for the cpuidle_cooling_register() function to
match the function prototype (Chenggang Wang)
- Fix inconsistent temperature read and some Mediatek variant board
reboot by reverting a change and handling the temperature
differently (AngeloGioacchino Del Regno)
- Fix a memory leak in the initialization error path for the Mediatek
driver (Kang Chen)
- Use of_address_to_resource() in the Mediatek driver (Rob Herring)
- Fix unit address in the QCom tsens driver DT bindings (Krzysztof
Kozlowski)
----------------------------------------------------------------
AngeloGioacchino Del Regno (2):
Revert "thermal/drivers/mediatek: Add delay after thermal banks
initialization"
thermal/drivers/mediatek: Add temperature constraints to validate
read
Chenggang Wang (1):
thermal/drivers/cpuidle_cooling: Delete unmatched comments
Kang Chen (2):
thermal/drivers/mediatek: Use devm_of_iomap to avoid resource
leak in mtk_thermal_probe
thermal/drivers/mediatek: Change clk_prepare_enable to
devm_clk_get_enabled in mtk_thermal_probe
Krzysztof Kozlowski (1):
dt-bindings: thermal: qcom-tsens: Correct unit address
Marijn Suijten (1):
dt-bindings: thermal: Use generic ADC node name in examples
Rob Herring (1):
thermal/drivers/mediatek: Use of_address_to_resource()
Stefan Wahren (1):
dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible
Documentation/devicetree/bindings/thermal/imx-thermal.yaml |
14 ++++++++++----
Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm-hc.yaml |
4 ++--
Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml |
9 ++++++---
Documentation/devicetree/bindings/thermal/qcom-tsens.yaml |
4 ++--
drivers/thermal/cpuidle_cooling.c |
3 ---
drivers/thermal/mediatek/auxadc_thermal.c |
89
++++++++++++++++++++++++++++++++++++++++++++---------------------------------------------
6 files changed, 64 insertions(+), 59 deletions(-)
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On Wed, Apr 26, 2023 at 11:27 AM Daniel Lezcano
<[email protected]> wrote:
>
>
> Hi Rafael,
>
> can you consider pulling these changes ? They have been in linux-next
> since several days and they fix some minor issues, except one of them
> which is an urgent one for Mediatek.
>
> The following changes since commit 5bc6b1df65c87f8dd7d0afe494a2c0b9d5c73140:
>
> thermal: intel: int340x: Add DLVR support for RFIM control
> (2023-04-18 15:24:40 +0200)
>
> are available in the Git repository at:
>
>
> ssh://[email protected]/pub/scm/linux/kernel/git/thermal/linux.git
> tags/thermal-v6.4-rc1-3
>
> for you to fetch changes up to 2afa82d1fc648c8d4c2ef9e876626abb1089f9ab:
>
> dt-bindings: thermal: qcom-tsens: Correct unit address (2023-04-26
> 10:38:35 +0200)
>
> ----------------------------------------------------------------
> - Add compatible strings DT bindings for imx6sll and imx6ul to fix
> dtbs check warning (Stefan Wahren)
>
> - Update the example in the DT bindings to reflect changes with the
> ADC node name for QCom TM and TM5 (Marijn Suijten)
>
> - Fix the comments for the cpuidle_cooling_register() function to
> match the function prototype (Chenggang Wang)
>
> - Fix inconsistent temperature read and some Mediatek variant board
> reboot by reverting a change and handling the temperature
> differently (AngeloGioacchino Del Regno)
>
> - Fix a memory leak in the initialization error path for the Mediatek
> driver (Kang Chen)
>
> - Use of_address_to_resource() in the Mediatek driver (Rob Herring)
>
> - Fix unit address in the QCom tsens driver DT bindings (Krzysztof
> Kozlowski)
>
> ----------------------------------------------------------------
> AngeloGioacchino Del Regno (2):
> Revert "thermal/drivers/mediatek: Add delay after thermal banks
> initialization"
> thermal/drivers/mediatek: Add temperature constraints to validate
> read
>
> Chenggang Wang (1):
> thermal/drivers/cpuidle_cooling: Delete unmatched comments
>
> Kang Chen (2):
> thermal/drivers/mediatek: Use devm_of_iomap to avoid resource
> leak in mtk_thermal_probe
> thermal/drivers/mediatek: Change clk_prepare_enable to
> devm_clk_get_enabled in mtk_thermal_probe
>
> Krzysztof Kozlowski (1):
> dt-bindings: thermal: qcom-tsens: Correct unit address
>
> Marijn Suijten (1):
> dt-bindings: thermal: Use generic ADC node name in examples
>
> Rob Herring (1):
> thermal/drivers/mediatek: Use of_address_to_resource()
>
> Stefan Wahren (1):
> dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible
>
> Documentation/devicetree/bindings/thermal/imx-thermal.yaml |
> 14 ++++++++++----
> Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm-hc.yaml |
> 4 ++--
> Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml |
> 9 ++++++---
> Documentation/devicetree/bindings/thermal/qcom-tsens.yaml |
> 4 ++--
> drivers/thermal/cpuidle_cooling.c |
> 3 ---
> drivers/thermal/mediatek/auxadc_thermal.c |
> 89
> ++++++++++++++++++++++++++++++++++++++++++++---------------------------------------------
> 6 files changed, 64 insertions(+), 59 deletions(-)
Pulled, thanks!