These patches introduce device tree binding support and
add an of_device_id table entry to the driver.
Anup Sharma (2):
dt-bindings: iio: temperature: Add support for tmp006
iio: temperature: tmp006: Add OF device matching support
.../bindings/iio/temperature/ti,tmp006.yaml | 42 +++++++++++++++++++
drivers/iio/temperature/tmp006.c | 10 ++++-
2 files changed, 51 insertions(+), 1 deletion(-)
create mode 100644 Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
--
2.34.1
Add devicetree binding document for TMP006, IR thermopile sensor.
Signed-off-by: Anup Sharma <[email protected]>
Changes:
V1 -> V2: Removed redundant dt-binding from subject.
Added supply information.
Adhere to the generic node name.
---
.../bindings/iio/temperature/ti,tmp006.yaml | 42 +++++++++++++++++++
1 file changed, 42 insertions(+)
create mode 100644 Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
diff --git a/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml b/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
new file mode 100644
index 000000000000..4915c3e2d721
--- /dev/null
+++ b/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
@@ -0,0 +1,42 @@
+# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/iio/temperature/ti,tmp006.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: TI TMP006 IR thermopile sensor
+
+maintainers:
+ - Peter Meerwald <[email protected]>
+
+description: |
+ TI TMP006 - Infrared Thermopile Sensor in Chip-Scale Package.
+ https://cdn.sparkfun.com/datasheets/Sensors/Temp/tmp006.pdf
+
+properties:
+ compatible:
+ const: ti,tmp006
+
+ reg:
+ maxItems: 1
+
+ vdd-supply:
+ description: provide VDD power to the sensor.
+
+required:
+ - compatible
+ - reg
+
+additionalProperties: false
+
+examples:
+ - |
+ i2c {
+ #address-cells = <1>;
+ #size-cells = <0>;
+ temperature-sensor@40 {
+ compatible = "ti,tmp006";
+ reg = <0x40>;
+ vdd-supply = <&ldo4_reg>
+ };
+ };
--
2.34.1
On Mon, 15 May 2023 00:31:59 +0530, Anup Sharma wrote:
> Add devicetree binding document for TMP006, IR thermopile sensor.
>
> Signed-off-by: Anup Sharma <[email protected]>
>
> Changes:
> V1 -> V2: Removed redundant dt-binding from subject.
> Added supply information.
> Adhere to the generic node name.
> ---
> .../bindings/iio/temperature/ti,tmp006.yaml | 42 +++++++++++++++++++
> 1 file changed, 42 insertions(+)
> create mode 100644 Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
>
My bot found errors running 'make DT_CHECKER_FLAGS=-m dt_binding_check'
on your patch (DT_CHECKER_FLAGS is new in v5.13):
yamllint warnings/errors:
dtschema/dtc warnings/errors:
Error: Documentation/devicetree/bindings/iio/temperature/ti,tmp006.example.dts:25.13-14 syntax error
FATAL ERROR: Unable to parse input tree
make[1]: *** [scripts/Makefile.lib:419: Documentation/devicetree/bindings/iio/temperature/ti,tmp006.example.dtb] Error 1
make[1]: *** Waiting for unfinished jobs....
make: *** [Makefile:1512: dt_binding_check] Error 2
See https://patchwork.ozlabs.org/patch/1781058
This check can fail if there are any dependencies. The base for a patch
series is generally the most recent rc1.
If you already ran 'make dt_binding_check' and didn't see the above
error(s), then make sure 'yamllint' is installed and dt-schema is up to
date:
pip3 install dtschema --upgrade
Please check and re-submit.
On 14/05/2023 21:01, Anup Sharma wrote:
> Add devicetree binding document for TMP006, IR thermopile sensor.
>
> Signed-off-by: Anup Sharma <[email protected]>
>
Missing ---
> Changes:
> V1 -> V2: Removed redundant dt-binding from subject.
> Added supply information.
> Adhere to the generic node name.
> ---
Best regards,
Krzysztof