Viresh Kumar <[email protected]> writes:
> On 22-10-15, 20:02, Dawei Chien wrote:
>> Use Intelligent Power Allocation (IPA) technical to add static/dynamic power model for binding CPU thermal zone.
>> The power allocator governor allocates power budget to control CPU temperature.
>>
>> Power Allocator governor is able to keep SOC temperature within a
>> defined temperature range to avoid SOC overheat and keep it's
>> performance. mt8173-cpufreq.c need to register its' own power model
>> with power allocator thermal governor, so that power allocator
>> governor can allocates suitable power budget to control CPU
>> temperature.
>>
>> PATCH1 is base on
>> https://patchwork.kernel.org/patch/7034601/
>>
>> PATCH2 is base on Sascha's thermal driver V9
>> https://patchwork.kernel.org/patch/7249821/
>> https://patchwork.kernel.org/patch/7249861/
>> https://patchwork.kernel.org/patch/7249891/
>>
>> Change since V1:
>> include mt8171.h and sort header file for mt8173.dtsi
>>
>> Change since V2:
>> Move dynamic/static power model in device tree
>>
>> Dawei.Chien (2):
>> thermal: mediatek: Add cpu power cooling model.
>> arm64: dts: mt8173: Add thermal zone node for mt8173.
>
> Sorry for being extremely late in reviewing this stuff. You are
> already on v3 and I haven't reviewed it once. Mostly due to bad timing
> of my holidays and other work pressure.
>
> Now, there are few things that I feel are not properly addressed here,
> and I may be wrong:
> - Where are the bindings for static-power-points and
> dynamic-power-coefficient. Sorry I failed to see them in this or
> other series you mentioned.
For dynamic power, I had posted some patches[0][1][2] introducing the
binding as well as updating cooling device registration via cpufreq
driver. Now that the SCPI hwmon driver is merged, I should re-send the
remaining patches.
[0] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01020.html
[1] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01022.html
[3] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01031.html
> - Even then, why should we be adding another table into DT for
> voltage/power ? And not reuse and extend the opp-v2 stuff which is
> already mainlined now.
> - There are few issues with the code as well, but I want to see where
> the bindings should go first. And then only discuss the code
> further.
On 02-11-15, 15:53, Punit Agrawal wrote:
> For dynamic power, I had posted some patches[0][1][2] introducing the
> binding as well as updating cooling device registration via cpufreq
> driver. Now that the SCPI hwmon driver is merged, I should re-send the
> remaining patches.
>
> [0] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01020.html
> [1] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01022.html
> [3] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01031.html
Sure. Just that whatever can be merged with opp-v2 should be merged.
--
viresh
On Mon, Nov 02, 2015 at 03:53:33PM +0000, Punit Agrawal wrote:
> Viresh Kumar <[email protected]> writes:
>
> > On 22-10-15, 20:02, Dawei Chien wrote:
> >> Use Intelligent Power Allocation (IPA) technical to add static/dynamic power model for binding CPU thermal zone.
> >> The power allocator governor allocates power budget to control CPU temperature.
> >>
> >> Power Allocator governor is able to keep SOC temperature within a
> >> defined temperature range to avoid SOC overheat and keep it's
> >> performance. mt8173-cpufreq.c need to register its' own power model
> >> with power allocator thermal governor, so that power allocator
> >> governor can allocates suitable power budget to control CPU
> >> temperature.
> >>
> >> PATCH1 is base on
> >> https://patchwork.kernel.org/patch/7034601/
> >>
> >> PATCH2 is base on Sascha's thermal driver V9
> >> https://patchwork.kernel.org/patch/7249821/
> >> https://patchwork.kernel.org/patch/7249861/
> >> https://patchwork.kernel.org/patch/7249891/
> >>
> >> Change since V1:
> >> include mt8171.h and sort header file for mt8173.dtsi
> >>
> >> Change since V2:
> >> Move dynamic/static power model in device tree
> >>
> >> Dawei.Chien (2):
> >> thermal: mediatek: Add cpu power cooling model.
> >> arm64: dts: mt8173: Add thermal zone node for mt8173.
> >
> > Sorry for being extremely late in reviewing this stuff. You are
> > already on v3 and I haven't reviewed it once. Mostly due to bad timing
> > of my holidays and other work pressure.
> >
> > Now, there are few things that I feel are not properly addressed here,
> > and I may be wrong:
> > - Where are the bindings for static-power-points and
> > dynamic-power-coefficient. Sorry I failed to see them in this or
> > other series you mentioned.
>
> For dynamic power, I had posted some patches[0][1][2] introducing the
> binding as well as updating cooling device registration via cpufreq
> driver. Now that the SCPI hwmon driver is merged, I should re-send the
> remaining patches.
>
> [0] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01020.html
Are you sure this binding is applicable only to ARM cpus?
> [1] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01022.html
> [3] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01031.html
>
> > - Even then, why should we be adding another table into DT for
> > voltage/power ? And not reuse and extend the opp-v2 stuff which is
> > already mainlined now.
> > - There are few issues with the code as well, but I want to see where
> > the bindings should go first. And then only discuss the code
> > further.
> --
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