2021-01-18 16:39:03

by Johan Jonker

Subject: [PATCH] arm64: dts: rockchip: cleanup cpu_thermal node of rk3399-rock960.dts

The cpu_thermal node in the rk3399-rock960.dts file does not
reference &cpu_thermal directly to add the board-specific parts,
but also repeats all the SoC default properties.
Clean the whole thing up and fix alignment.
Place node in the correct alphabetical order.

Suggested-by: Robin Murphy <[email protected]>
Signed-off-by: Johan Jonker <[email protected]>
---
arch/arm64/boot/dts/rockchip/rk3399-rock960.dts | 75 ++++++++++++-------------
1 file changed, 36 insertions(+), 39 deletions(-)

diff --git a/arch/arm64/boot/dts/rockchip/rk3399-rock960.dts b/arch/arm64/boot/dts/rockchip/rk3399-rock960.dts
index b20774081..bff8a73d9 100644
--- a/arch/arm64/boot/dts/rockchip/rk3399-rock960.dts
+++ b/arch/arm64/boot/dts/rockchip/rk3399-rock960.dts
@@ -63,6 +63,42 @@

};

+&cpu_thermal {
+ polling-delay-passive = <100>;
+ polling-delay = <1000>;
+ thermal-sensors = <&tsadc 0>;
+ sustainable-power = <1550>;
+
+ trips {
+ cpu_alert0: cpu_alert0 {
+ temperature = <65000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ cpu_alert1: cpu_alert1 {
+ temperature = <75000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ cpu_crit: cpu_crit {
+ temperature = <95000>;
+ hysteresis = <2000>;
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&cpu_alert1>;
+ cooling-device =
+ <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
+ <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+ };
+ };
+};
+
&pcie0 {
ep-gpios = <&gpio2 RK_PA2 GPIO_ACTIVE_HIGH>;
};
@@ -125,45 +161,6 @@
status = "okay";
};

-&thermal_zones {
- cpu_thermal: cpu-thermal {
- polling-delay-passive = <100>;
- polling-delay = <1000>;
- thermal-sensors = <&tsadc 0>;
- sustainable-power = <1550>;
-
- trips {
- cpu_alert0: cpu_alert0 {
- temperature = <65000>;
- hysteresis = <2000>;
- type = "passive";
- };
-
- cpu_alert1: cpu_alert1 {
- temperature = <75000>;
- hysteresis = <2000>;
- type = "passive";
- };
-
- cpu_crit: cpu_crit {
- temperature = <95000>;
- hysteresis = <2000>;
- type = "critical";
- };
- };
-
- cooling-maps {
- map0 {
-
- trip = <&cpu_alert1>;
- cooling-device =
- <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
- <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
- };
- };
- };
-};
-
&usbdrd_dwc3_0 {
dr_mode = "otg";
};
--
2.11.0

2021-01-19 04:47:54

by Johan Jonker

Subject: Re: [PATCH] arm64: dts: rockchip: cleanup cpu_thermal node of rk3399-rock960.dts

Hi,

Sorry.
This can go in the bin...
It needs more cleanup...
See question below.

On 1/18/21 5:33 PM, Johan Jonker wrote:
> The cpu_thermal node in the rk3399-rock960.dts file does not
> reference &cpu_thermal directly to add the board-specific parts,
> but also repeats all the SoC default properties.
> Clean the whole thing up and fix alignment.
> Place node in the correct alphabetical order.
>
> Suggested-by: Robin Murphy <[email protected]>
> Signed-off-by: Johan Jonker <[email protected]>
> ---
> arch/arm64/boot/dts/rockchip/rk3399-rock960.dts | 75 ++++++++++++-------------
> 1 file changed, 36 insertions(+), 39 deletions(-)
>
> diff --git a/arch/arm64/boot/dts/rockchip/rk3399-rock960.dts b/arch/arm64/boot/dts/rockchip/rk3399-rock960.dts
> index b20774081..bff8a73d9 100644
> --- a/arch/arm64/boot/dts/rockchip/rk3399-rock960.dts
> +++ b/arch/arm64/boot/dts/rockchip/rk3399-rock960.dts
> @@ -63,6 +63,42 @@
>
> };
>
> +&cpu_thermal {
> + polling-delay-passive = <100>;
> + polling-delay = <1000>;
> + thermal-sensors = <&tsadc 0>;
> + sustainable-power = <1550>;
> +
> + trips {
> + cpu_alert0: cpu_alert0 {
> + temperature = <65000>;
> + hysteresis = <2000>;
> + type = "passive";
> + };
> +
> + cpu_alert1: cpu_alert1 {
> + temperature = <75000>;
> + hysteresis = <2000>;
> + type = "passive";
> + };
> +
> + cpu_crit: cpu_crit {
> + temperature = <95000>;
> + hysteresis = <2000>;
> + type = "critical";
> + };
> + };
> +
> + cooling-maps {
> + map0 {
> + trip = <&cpu_alert1>;
> + cooling-device =
> + <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> + <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> + };
> + };
> +};
> +
> &pcie0 {
> ep-gpios = <&gpio2 RK_PA2 GPIO_ACTIVE_HIGH>;
> };
> @@ -125,45 +161,6 @@
> status = "okay";
> };
>
> -&thermal_zones {
> - cpu_thermal: cpu-thermal {
> - polling-delay-passive = <100>;
> - polling-delay = <1000>;
> - thermal-sensors = <&tsadc 0>;
> - sustainable-power = <1550>;
> -
> - trips {
> - cpu_alert0: cpu_alert0 {
> - temperature = <65000>;
> - hysteresis = <2000>;
> - type = "passive";
> - };
> -
> - cpu_alert1: cpu_alert1 {
> - temperature = <75000>;
> - hysteresis = <2000>;
> - type = "passive";
> - };
> -
> - cpu_crit: cpu_crit {
> - temperature = <95000>;
> - hysteresis = <2000>;
> - type = "critical";
> - };
> - };
> -
> - cooling-maps {

> - map0 {
> -
> - trip = <&cpu_alert1>;

The trip property points to "cpu_alert1", while in rk3399.dtsi that is
"&cpu_alert0"
What is correct here?


> - cooling-device =
> - <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> - <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> - };
> - };
> - };
> -};
> -
> &usbdrd_dwc3_0 {
> dr_mode = "otg";
> };
>


map0 {
trip = <&cpu_alert0>;
cooling-device =
<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
<&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
};