Add VTM bindings documentation. In the Voltage Thermal
Management Module(VTM), K3 J72XX supplies a voltage
reference and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.
Signed-off-by: Keerthy <[email protected]>
---
.../bindings/thermal/ti,j72xx-thermal.yaml | 64 +++++++++++++++++++
1 file changed, 64 insertions(+)
create mode 100644 Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml
diff --git a/Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml b/Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml
new file mode 100644
index 000000000000..84b70fb108da
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml
@@ -0,0 +1,64 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/ti,j72xx-thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Texas Instruments J72XX VTM (DTS) binding
+
+maintainers:
+ - Keerthy <[email protected]>
+
+properties:
+ compatible:
+ items:
+ - enum:
+ - ti,j721e-vtm
+ - ti,j7200-vtm
+
+ reg:
+ maxItems: 3
+ description:
+ Must be 3, in order to specify three register spaces for VTM cfg1, cfg2
+ and efuse register space.
+
+ power-domains:
+ maxItems: 1
+
+ "#thermal-sensor-cells":
+ const: 1
+
+required:
+ - compatible
+ - reg
+ - power-domains
+ - "#thermal-sensor-cells"
+
+additionalProperties: false
+
+examples:
+ - |
+ #include <dt-bindings/soc/ti,sci_pm_domain.h>
+ wkup_vtm0: thermal-sensor@42040000 {
+ compatible = "ti,j721e-vtm";
+ reg = <0x42040000 0x350>,
+ <0x42050000 0x350>,
+ <0x43000300 0x10>;
+ power-domains = <&k3_pds 154 TI_SCI_PD_EXCLUSIVE>;
+ #thermal-sensor-cells = <1>;
+ };
+
+ mpu_thermal: mpu-thermal {
+ polling-delay-passive = <250>; /* milliseconds */
+ polling-delay = <500>; /* milliseconds */
+ thermal-sensors = <&wkup_vtm0 0>;
+
+ trips {
+ mpu_crit: mpu-crit {
+ temperature = <125000>; /* milliCelsius */
+ hysteresis = <2000>; /* milliCelsius */
+ type = "critical";
+ };
+ };
+ };
+...
--
2.17.1
On Wed, 27 Apr 2022 12:16:32 +0530, Keerthy wrote:
> Add VTM bindings documentation. In the Voltage Thermal
> Management Module(VTM), K3 J72XX supplies a voltage
> reference and a temperature sensor feature that are gathered in the band
> gap voltage and temperature sensor (VBGAPTS) module. The band
> gap provides current and voltage reference for its internal
> circuits and other analog IP blocks. The analog-to-digital
> converter (ADC) produces an output value that is proportional
> to the silicon temperature.
>
> Signed-off-by: Keerthy <[email protected]>
> ---
> .../bindings/thermal/ti,j72xx-thermal.yaml | 64 +++++++++++++++++++
> 1 file changed, 64 insertions(+)
> create mode 100644 Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml
>
Reviewed-by: Rob Herring <[email protected]>
On 4/27/2022 12:16 PM, Keerthy wrote:
> Add VTM bindings documentation. In the Voltage Thermal
> Management Module(VTM), K3 J72XX supplies a voltage
> reference and a temperature sensor feature that are gathered in the band
> gap voltage and temperature sensor (VBGAPTS) module. The band
> gap provides current and voltage reference for its internal
> circuits and other analog IP blocks. The analog-to-digital
> converter (ADC) produces an output value that is proportional
> to the silicon temperature.
Hi krzysztof,
Any comments on this version?
- Keerthy
>
> Signed-off-by: Keerthy <[email protected]>
> ---
> .../bindings/thermal/ti,j72xx-thermal.yaml | 64 +++++++++++++++++++
> 1 file changed, 64 insertions(+)
> create mode 100644 Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml
>
> diff --git a/Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml b/Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml
> new file mode 100644
> index 000000000000..84b70fb108da
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml
> @@ -0,0 +1,64 @@
> +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
> +%YAML 1.2
> +---
> +$id: http://devicetree.org/schemas/thermal/ti,j72xx-thermal.yaml#
> +$schema: http://devicetree.org/meta-schemas/core.yaml#
> +
> +title: Texas Instruments J72XX VTM (DTS) binding
> +
> +maintainers:
> + - Keerthy <[email protected]>
> +
> +properties:
> + compatible:
> + items:
> + - enum:
> + - ti,j721e-vtm
> + - ti,j7200-vtm
> +
> + reg:
> + maxItems: 3
> + description:
> + Must be 3, in order to specify three register spaces for VTM cfg1, cfg2
> + and efuse register space.
> +
> + power-domains:
> + maxItems: 1
> +
> + "#thermal-sensor-cells":
> + const: 1
> +
> +required:
> + - compatible
> + - reg
> + - power-domains
> + - "#thermal-sensor-cells"
> +
> +additionalProperties: false
> +
> +examples:
> + - |
> + #include <dt-bindings/soc/ti,sci_pm_domain.h>
> + wkup_vtm0: thermal-sensor@42040000 {
> + compatible = "ti,j721e-vtm";
> + reg = <0x42040000 0x350>,
> + <0x42050000 0x350>,
> + <0x43000300 0x10>;
> + power-domains = <&k3_pds 154 TI_SCI_PD_EXCLUSIVE>;
> + #thermal-sensor-cells = <1>;
> + };
> +
> + mpu_thermal: mpu-thermal {
> + polling-delay-passive = <250>; /* milliseconds */
> + polling-delay = <500>; /* milliseconds */
> + thermal-sensors = <&wkup_vtm0 0>;
> +
> + trips {
> + mpu_crit: mpu-crit {
> + temperature = <125000>; /* milliCelsius */
> + hysteresis = <2000>; /* milliCelsius */
> + type = "critical";
> + };
> + };
> + };
> +...
On 09/05/2022 05:18, J, KEERTHY wrote:
>
>
> On 4/27/2022 12:16 PM, Keerthy wrote:
>> Add VTM bindings documentation. In the Voltage Thermal
>> Management Module(VTM), K3 J72XX supplies a voltage
>> reference and a temperature sensor feature that are gathered in the band
>> gap voltage and temperature sensor (VBGAPTS) module. The band
>> gap provides current and voltage reference for its internal
>> circuits and other analog IP blocks. The analog-to-digital
>> converter (ADC) produces an output value that is proportional
>> to the silicon temperature.
>
> Hi krzysztof,
>
> Any comments on this version?
You got Rob's review, so you don't need also mine.
If you want, then in general look okay, except the description for "reg"
you could split per items:
reg:
items:
- description: VTM cfg1 register space
- description: VTM cfg2 register space
- description: efuse register space
It's more obvious what items you expect.
Best regards,
Krzysztof
On 11/05/2022 09:53, J, KEERTHY wrote:
>>>
>>> Any comments on this version?
>>
>> You got Rob's review, so you don't need also mine.
>>
>> If you want, then in general look okay, except the description for "reg"
>> you could split per items:
>>
>> reg:
>> items:
>> - description: VTM cfg1 register space
>> - description: VTM cfg2 register space
>> - description: efuse register space
>>
>> It's more obvious what items you expect.
>
> Hi Krzysztof,
>
> DTEX
> Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.example.dts
> Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml: found
> duplicate key "description" with value "VTM cfg2 register space"
> (original value: "VTM cfg1 register space")
> Documentation/devicetree/bindings/Makefile:26: recipe for target
> 'Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.example.dts'
> failed
> make[1]: ***
> [Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.example.dts] Er
>
> I believe multiple instances of description is failing. So can i keep
> the description as is?
It looks weird. Can you share your code (pastebin/github/paste here)?
Best regards,
Krzysztof
On 5/9/2022 12:12 PM, Krzysztof Kozlowski wrote:
> On 09/05/2022 05:18, J, KEERTHY wrote:
>>
>>
>> On 4/27/2022 12:16 PM, Keerthy wrote:
>>> Add VTM bindings documentation. In the Voltage Thermal
>>> Management Module(VTM), K3 J72XX supplies a voltage
>>> reference and a temperature sensor feature that are gathered in the band
>>> gap voltage and temperature sensor (VBGAPTS) module. The band
>>> gap provides current and voltage reference for its internal
>>> circuits and other analog IP blocks. The analog-to-digital
>>> converter (ADC) produces an output value that is proportional
>>> to the silicon temperature.
>>
>> Hi krzysztof,
>>
>> Any comments on this version?
>
> You got Rob's review, so you don't need also mine.
>
> If you want, then in general look okay, except the description for "reg"
> you could split per items:
>
> reg:
> items:
> - description: VTM cfg1 register space
> - description: VTM cfg2 register space
> - description: efuse register space
>
> It's more obvious what items you expect.
Hi Krzysztof,
DTEX
Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.example.dts
Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml: found
duplicate key "description" with value "VTM cfg2 register space"
(original value: "VTM cfg1 register space")
Documentation/devicetree/bindings/Makefile:26: recipe for target
'Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.example.dts'
failed
make[1]: ***
[Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.example.dts] Er
I believe multiple instances of description is failing. So can i keep
the description as is?
- Keerthy
>
> Best regards,
> Krzysztof
On 5/11/2022 1:45 PM, Krzysztof Kozlowski wrote:
> On 11/05/2022 09:53, J, KEERTHY wrote:
>>>>
>>>> Any comments on this version?
>>>
>>> You got Rob's review, so you don't need also mine.
>>>
>>> If you want, then in general look okay, except the description for "reg"
>>> you could split per items:
>>>
>>> reg:
>>> items:
>>> - description: VTM cfg1 register space
>>> - description: VTM cfg2 register space
>>> - description: efuse register space
>>>
>>> It's more obvious what items you expect.
>>
>> Hi Krzysztof,
>>
>> DTEX
>> Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.example.dts
>> Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml: found
>> duplicate key "description" with value "VTM cfg2 register space"
>> (original value: "VTM cfg1 register space")
>> Documentation/devicetree/bindings/Makefile:26: recipe for target
>> 'Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.example.dts'
>> failed
>> make[1]: ***
>> [Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.example.dts] Er
>>
>> I believe multiple instances of description is failing. So can i keep
>> the description as is?
>
> It looks weird. Can you share your code (pastebin/github/paste here)?
My bad. I had missed the '-' before description & hence it was erring
out. I fixed. I will post v7 of this patch alone.
Thanks,
Keerthy
>
>
> Best regards,
> Krzysztof